Multilayer printed wiring board
First Claim
Patent Images
1. A multilayer printed wiring board comprising:
- a plurality of insulating layers;
a plurality of conductor layers stacked alternately over the insulating layers, respectively; and
a plurality of viaholes formed in the insulation layers and electrically connecting the conductor layers through the insulation layers,wherein the viaholes include a first group of viaholes and a second group of viaholes, the viaholes in the first group are tapered toward the viaholes in the second group, the viaholes in the second group are tapered toward the viaholes in the first group, the viaholes in the first group and the the viaholes in the second group are formed in the insulating layers, respectively, the viaholes are formed by plating a plurality of openings formed after lamination of respective ones of the insulating layers, and each of the insulating layers is about 100 μ
m or less in thickness.
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Abstract
A multilayer printed wiring board including insulating layers, conductor layers stacked alternately over the insulating layers, respectively, and viaholes formed in the insulation layers and electrically connecting the conductor layers through the insulation layers. The viaholes include a first group of viaholes and a second group of viaholes. The viaholes in the first group are tapered toward the viaholes in the second group, and the viaholes in the second group are tapered toward the viaholes in the first group. The viaholes in the first group and the the viaholes in the second group are formed in the insulating layers, respectively, and the viaholes are formed by plating openings formed after lamination of respective ones of the insulating layers, and each of the insulating layers is about 100 μm or less in thickness.
24 Citations
20 Claims
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1. A multilayer printed wiring board comprising:
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a plurality of insulating layers; a plurality of conductor layers stacked alternately over the insulating layers, respectively; and a plurality of viaholes formed in the insulation layers and electrically connecting the conductor layers through the insulation layers, wherein the viaholes include a first group of viaholes and a second group of viaholes, the viaholes in the first group are tapered toward the viaholes in the second group, the viaholes in the second group are tapered toward the viaholes in the first group, the viaholes in the first group and the the viaholes in the second group are formed in the insulating layers, respectively, the viaholes are formed by plating a plurality of openings formed after lamination of respective ones of the insulating layers, and each of the insulating layers is about 100 μ
m or less in thickness. - View Dependent Claims (2, 3, 4)
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5. A multilayer printed wiring board comprising:
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a plurality of insulating layers including an outermost insulating layer; a plurality of conductor layers stacked alternately over the insulating layers, respectively; and a plurality of viaholes formed in the insulation layers and electrically connecting the conductor layers through the insulation layers, wherein the viaholes include a first group of viaholes and a second group of viaholes, the viaholes in the first group are tapered toward the viaholes in the second group, the viaholes in the second group are tapered toward the viaholes in the first group, the viaholes are formed by plating a plurality of openings formed after lamination of respective ones of the insulating layers, each of the insulating layers is about 100 μ
m or less in thickness, and the viaholes in the first group are stacked on top of each other and include a viahole formed in the outermost insulating layer. - View Dependent Claims (6, 7, 8)
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9. A multilayer printed wiring board comprising:
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a plurality of insulating layers; a plurality of conductor layers stacked alternately over the insulating layers, respectively; and a plurality of viaholes formed in the insulation layers and electrically connecting the conductor layers through the insulation layers, wherein the viaholes include a first group of viaholes and a second group of viaholes, the viaholes in the first group are tapered toward the viaholes in the second group, the viaholes in the second group are tapered toward the viaholes in the first group, the conductor layers include a conductor layer on which the viaholes in the first group and the viaholes in the second group are stacked, the viaholes are formed by plating a plurality of openings formed after lamination of respective ones of the insulating layers, and each of the insulating layers is about 100 μ
m or less in thickness. - View Dependent Claims (10, 11, 12)
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13. A multilayer printed wiring board comprising:
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a plurality of insulating layers; a plurality of conductor layers stacked alternately over the insulating layers, respectively; and a plurality of viaholes formed in the insulation layers and electrically connecting the conductor layers through the insulation layers, wherein the viaholes include a first group of viaholes and a second group of viaholes, the viaholes in the first group are tapered toward the viaholes in the second group, the viaholes in the second group are tapered toward the viaholes in the first group, the insulating layers are divided into a first side in which the viaholes in the first group are formed and a second side in which the the viaholes in the second group are formed, the viaholes are formed by plating a plurality of openings formed after lamination of respective ones of the insulating layers, and each of the insulating layers is about 100 μ
m or less in thickness. - View Dependent Claims (14, 15, 16)
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17. A multilayer printed wiring board comprising:
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a plurality of insulating layers; a plurality of conductor layers stacked alternately over the insulating layers, respectively; and a plurality of viaholes formed in the insulation layers and electrically connecting the conductor layers through the insulation layers, wherein the viaholes include a first group of viaholes and a second group of viaholes, the viaholes in the first group are tapered toward the viaholes in the second group such that the viaholes in the first group decrease viahole sizes in a direction toward the viaholes in the second group, respectively, the viaholes in the second group are tapered toward the viaholes in the first group, the viaholes in the first group and the the viaholes in the second group are formed in the insulating layers, respectively, the viaholes are formed by plating a plurality of openings formed after lamination of respective ones of the insulating layers, and each of the insulating layers are about 100 μ
m or less in thickness. - View Dependent Claims (18, 19, 20)
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Specification
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Current AssigneeIbiden Co., Ltd.
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Original AssigneeIbiden Co., Ltd.
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InventorsTakahashi, Michimasa, Mikado, Yukinobu, Nakamura, Takenobu, Aoyama, Masakazu
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Primary Examiner(s)Mandala, Victor A
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Assistant Examiner(s)SODERHOLM, KRISTA Z
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Application NumberUS12/819,805Publication NumberTime in Patent Office743 DaysField of Search257/774, 257/E23.062, 174/250US Class Current257/774CPC Class CodesH01L 23/48 Arrangements for conducting...H01L 2924/00 Indexing scheme for arrange...H01L 2924/0002 Not covered by any one of g...H05K 1/115 Via connections; Lands arou...H05K 2201/0352 Differences between the con...H05K 2201/0394 Conductor crossing over a h...H05K 2201/09563 Metal filled via plated thr...H05K 2201/096 Vertically aligned vias, ho...H05K 2201/09709 Staggered pads, lands or te...H05K 2201/09827 Tapered, e.g. tapered hole,...H05K 3/00 Apparatus or processes for ...H05K 3/4602 characterized by a special ...H05K 3/4652 Adding a circuit layer by l...Y10T 29/49124 On flat or curved insulated...
