Optical disc

• US 8,228,765 B2
• Filed: 11/14/2011
• Issued: 07/24/2012
• Est. Priority Date: 06/30/2006
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Dokai, Yuya, Kato, Noboru, Kimura, Ikuhei
• Primary Examiner(s): Neyzari, Ali
• Application Number:
  US13/295,153
• Publication Number:
  US 20120056001A1
• Time in Patent Office: 253 Days
• Field of Search: 369/13.38, 369/13.35, 369/13.4, 369/13.41, 369/13.42, 369/13.23, 235/435, 235/486, 257/678, 343/700.MS, 343/850
• US Class Current: 369/13.38
• CPC Class Codes: G11B 20/00086 Circuits for prevention of unauthorised reproduction or copying, e.g. piracy indicating unauthorised use of record carriers in general G11B23/28; scrambling for television signal recording H04N5/913; network architectures or network protocols for network security H04L63/00; cryptographic mechanisms or cryptographic arrangements for secret or secure communication H04L9/00
• CPC Class Codes: G11B 20/00094 involving measures which result in a restriction to authorised record carriers
• CPC Class Codes: G11B 20/00173 wherein the origin of the content is checked, e.g. determining whether the content has originally been retrieved from a legal disc copy or another trusted source
• CPC Class Codes: G11B 20/0021 involving encryption or decryption of contents recorded on or reproduced from a record carrier
• CPC Class Codes: G11B 20/00253 wherein the key is stored on the record carrier
• CPC Class Codes: G11B 20/00275 the key being stored on a chip attached to the record carrier
• CPC Class Codes: G11B 20/00492 wherein content or user data is encrypted
• CPC Class Codes: G11B 20/00695 said measures preventing that data are read from the recording medium
• CPC Class Codes: G11B 20/00876 wherein physical copy protection means are attached to the medium, e.g. holograms, sensors, or additional semiconductor circuitry
• CPC Class Codes: G11B 2220/2537 Optical discs
• CPC Class Codes: G11B 23/286 Antitheft arrangements, e.g. Electronic Article Surveillance [EAS] tags
• CPC Class Codes: G11B 23/30 with provision for auxiliary signals
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation

Abstract

An optical disc includes an electromagnetic coupling module mounted therein. The electromagnetic coupling module includes a wireless IC chip and a feeder circuit substrate in which a feeder circuit including a resonant circuit having a predetermined resonant frequency is disposed. The electromagnetic coupling module is electromagnetically coupled to a reflective film defining a metal thin film of the optical disc, and the reflective film defines an antenna or radiation pattern of the electromagnetic coupling module.

Claims

1. An optical disc comprising:

a reflective film defined by a metal thin film;

a wireless IC chip; and

a feeder circuit including a conductor pattern connected to the wireless IC chip;

wherein

the conductor pattern is arranged to overlap a portion of the reflective film such that the conductor pattern is electromagnetically coupled with the reflective film; and

the reflective film defines an antenna or a radiation pattern.

2. The optical disc according to claim 1, wherein the feeder circuit is provided adjacent to a central hole in the reflective film.

3. The optical disc according to claim 1, wherein the feeder circuit includes a resonant circuit having a predetermined resonant frequency, and the conductor pattern defines the resonant circuit.

4. The optical disc according to claim 3, wherein the resonant circuit includes at least one of a coil electrode pattern and a capacitor electrode pattern.

5. The optical disc according to claim 4, wherein the resonant circuit includes the coil electrode pattern, and a winding axis of the coil electrode pattern is substantially perpendicular to the reflective film.

6. The optical disc according to claim 1, further comprising a resin layer, wherein the reflective film is provided in the resin layer, and the wireless IC chip is embedded in the resin layer.