Layout generating method for semiconductor integrated circuits
First Claim
Patent Images
1. A design layout generating method, the method including:
- modifying, using a computer, a first design pattern for a semiconductor device, included in a first modification area extracted from a design layout by a first modifying method; and
modifying, using the computer, a second design pattern for the semiconductor device, included in a second modification area extracted from the design layout by a second modifying method on the basis of a pattern modifying guideline calculated from at least a partial design layout in the second modification area, such that the second modification area includes the first modification area,wherein, when two second modification areas extracted from a design layout are close to each other or parts of them overlap with each other, the two second modification areas are put together into a single second modification area.
1 Assignment
0 Petitions
Accused Products
Abstract
A design layout generating method for generating a design pattern of a semiconductor integrated circuit is disclosed. This method comprises modifying a first modification area extracted from a design layout by a first modifying method, and modifying a second modification area extracted from the design layout so as to include the first modification area by a second modifying method on the basis of a pattern modifying guideline calculated from at least a partial design layout in the second modification area.
15 Citations
12 Claims
-
1. A design layout generating method, the method including:
-
modifying, using a computer, a first design pattern for a semiconductor device, included in a first modification area extracted from a design layout by a first modifying method; and modifying, using the computer, a second design pattern for the semiconductor device, included in a second modification area extracted from the design layout by a second modifying method on the basis of a pattern modifying guideline calculated from at least a partial design layout in the second modification area, such that the second modification area includes the first modification area, wherein, when two second modification areas extracted from a design layout are close to each other or parts of them overlap with each other, the two second modification areas are put together into a single second modification area. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
-
10. A design layout generating method, the method including:
-
modifying, using a computer, a first design pattern for a semiconductor device, included in a first modification area extracted from a design layout by a first modifying method; and modifying, using the computer, a second design pattern for the semiconductor device, included in a second modification area extracted from the design layout by a second modifying method on the basis of a pattern modifying guideline calculated from at least a partial design layout in the second modification area, such that the second modification area includes the first modification area, wherein the first and second modifying methods are so configured that an evaluated value calculated on the basis of a pattern formed on a wafer according to a design layout modified by the first modifying method is higher than an evaluated value calculated on the basis of a pattern formed on the wafer according to a design layout before modification by the first modifying method and that an evaluated value calculated on the basis of a pattern formed on the wafer according to a design layout modified by the second modifying method is higher than an evaluated value calculated on the basis of a pattern formed on the wafer according to a design layout before modification by the second modifying method.
-
-
11. A non-transitory computer-readable medium configured to store program instructions for execution on a computer, the program instructions causing the computer to perform:
-
modifying, using the computer, a first design pattern for a semiconductor, included in a first modification area extracted from a design layout by a first modifying method; and modifying, using the computer, a second design pattern for the semiconductor device, included in a second modification area extracted from the design layout by a second modifying method on the basis of a pattern modifying guideline calculated from at least a partial design layout in the second modification area, such that the second modification area includes the first modification area, wherein, when two second modification areas extracted from a design layout are close to each other or parts of them overlap with each other, the two second modification areas are put together into a single second modification area.
-
-
12. A non-transitory computer-readable medium configured to store program instructions for execution on a computer, the program instructions causing the computer to perform:
-
modifying, using the computer, a first design pattern for a semiconductor, included in a first modification area extracted from a design layout by a first modifying method; and modifying, using the computer, a second design pattern for the semiconductor device, included in a second modification area extracted from the design layout by a second modifying method on the basis of a pattern modifying guideline calculated from at least a partial design layout in the second modification area, such that the second modification area includes the first modification area, wherein the first and second modifying methods are so configured that an evaluated value calculated on the basis of a pattern formed on a wafer according to a design layout modified by the first modifying method is higher than an evaluated value calculated on the basis of a pattern formed on the wafer according to a design layout before modification by the first modifying method and that an evaluated value calculated on the basis of a pattern formed on the wafer according to a design layout modified by the second modifying method is higher than an evaluated value calculated on the basis of a pattern formed on the wafer according to a design layout before modification by the second modifying method.
-
Specification