Adhesive encapsulating composition and electronic devices made therewith
First Claim
Patent Images
1. An adhesive encapsulating composition for use in an electronic device, comprising:
- a first polyisobutylene resin having a weight average molecular weight of greater than about 300,000 g/mol; and
a multifunctional (meth)acrylate monomer;
wherein the adhesive encapsulating composition is substantially free of tackifier.
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Abstract
Adhesive encapsulating compositions for use in electronic devices such as organic electroluminescent devices, touch screens, photovoltaic devices, and thin film transistors are disclosed herein. The adhesive encapsulating compositions include pressure sensitive adhesives comprising one or more polyisobutylene resins, in combination with optional multifunctional (meth)acrylate monomers and/or optional tackifiers.
62 Citations
27 Claims
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1. An adhesive encapsulating composition for use in an electronic device, comprising:
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a first polyisobutylene resin having a weight average molecular weight of greater than about 300,000 g/mol; and a multifunctional (meth)acrylate monomer; wherein the adhesive encapsulating composition is substantially free of tackifier. - View Dependent Claims (2, 3, 15, 16, 17, 18, 19, 20, 21, 22)
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4. An adhesive encapsulating composition for use in an electronic device, comprising:
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a first polyisobutylene resin having a weight average molecular weight of greater than about 300,000 g/mol; and a second polyisobutylene resin having a weight average molecular weight of less than about 100,000 g/mol, wherein the adhesive encapsulating composition is substantially free of tackifier. - View Dependent Claims (5, 6, 7, 8)
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9. An adhesive encapsulating composition for use in an electronic device, comprising:
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a second polyisobutylene resin having a weight average molecular weight of less than about 300,000 g/mol; a multifunctional (meth)acrylate monomer; and a tackifier, wherein the adhesive encapsulating composition is free of a first polyisobutylene having a weight average molecular weight of greater than about 300,000 g/mol. - View Dependent Claims (10, 11)
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12. An adhesive encapsulating composition for use in an electronic device, comprising:
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a first polyisobutylene resin having a weight average molecular weight of greater than about 300,000 g/mol, wherein the first polyisobutylene resin comprises 20 wt. % or less of the total weight of the adhesive encapsulating composition; a second polyisobutylene resin having a weight average molecular weight of less than about 300,000 g/mol; a multifunctional (meth)acrylate monomer; and a tackifier. - View Dependent Claims (13, 14)
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23. An organic electroluminescent device comprising:
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a pair of opposing electrodes; a light-emitting unit having at least an organic light-emitting layer, the light-emitting unit disposed between the pair of opposing electrodes; and an adhesive encapsulating composition disposed on, above, or around the light-emitting unit, the adhesive encapsulating composition comprising; a first polyisobutylene resin having a weight average molecular weight of greater than about 300,000 g/mol; and a multifunctional (meth)acrylate monomer; wherein the adhesive encapsulating composition is substantially free of tackifier. - View Dependent Claims (24)
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25. A touch screen comprising:
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a glass or polymeric substrate; a substantially transparent conductive metal disposed on the substrate; and an adhesive encapsulating composition disposed on, above, or around the metal, the adhesive encapsulating composition comprising; a first polyisobutylene resin having a weight average molecular weight of greater than about 300,000 g/mol; and a multifunctional (meth)acrylate monomer; wherein the adhesive encapsulating composition is substantially free of tackifier.
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26. A photovoltaic device comprising:
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a photovoltaic cell or an array of photovoltaic cells; and an adhesive encapsulating composition disposed on, above, or around the photovoltaic cell or any one of the photovoltaic cells of the array of photovoltaic cells, the adhesive encapsulating composition comprising; a first polyisobutylene resin having a weight average molecular weight of greater than about 300,000 g/mol; and a multifunctional (meth)acrylate monomer; wherein the adhesive encapsulating composition is substantially free of tackifier.
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27. A thin film transistor comprising:
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a semiconductor layer; and an adhesive encapsulating composition disposed on, above, or around the semiconductor layer, the adhesive encapsulating composition comprising; a first polyisobutylene resin having a weight average molecular weight of greater than about 300,000 g/mol; and a multifunctional (meth)acrylate monomer; wherein the adhesive encapsulating composition is substantially free of tackifier.
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Specification