Wireless IC device and component for wireless IC device

• US 8,235,299 B2
• Filed: 12/19/2008
• Issued: 08/07/2012
• Est. Priority Date: 07/04/2007
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Kato, Noboru, Ikemoto, Nobuo
• Primary Examiner(s): Lee, Seung
• Application Number:
  US12/339,198
• Publication Number:
  US 20090121030A1
• Time in Patent Office: 1,327 Days
• Field of Search: 235/383, 235/385, 235/439, 235/492, 235/493, 343/700.R
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07756 the connection being non-galvanic, e.g. capacitive
• CPC Class Codes: G06K 19/07758 arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
• CPC Class Codes: G06K 19/07771 the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H04B 5/22 Capacitive coupling

Abstract

A wireless IC device includes a cutout portion having no aluminum-deposited film that is provided at an end of an article package made of an aluminum-deposited laminated film, and an electromagnetic coupling module is provided at the cutout portion. The electromagnetic coupling module and the aluminum-deposited film of the package define a wireless IC device. A loop electrode, which is a magnetic field transmission auxiliary radiator of the electromagnetic coupling module, is coupled to the aluminum-deposited film of the package. Thus, the article package functions as a radiator of an antenna.

Claims

1. A wireless IC device comprising:

a high-frequency device defined by one of an electromagnetic coupling module or a wireless IC chip, said electromagnetic module including a wireless IC and a power supply circuit substrate electrically connected or electromagnetically coupled to the wireless IC while being coupled to an external circuit; and

a radiation electrode defined by a portion of an article and functioning as a radiator;

wherein

the high-frequency device is mounted on the radiation electrode; and

the radiation electrode is coupled to the high-frequency device.

2. The wireless IC device according to claim 1, wherein

the radiation electrode includes a conductive portion;

a cutout portion is provided at an edge of the conductive portion; and

the high-frequency device is arranged at the cutout portion and is coupled to the conductive portion at the cutout portion of the conductive portion.

3. The wireless IC device according to claim 1, wherein

the radiation electrode includes a conductive portion;

the conductive portion includes a non-conductive portion; and

the high-frequency device is arranged at an end of the non-conductive portion and is coupled to the conductive portion around the non-conductive portion.

4. The wireless IC device according to claim 1, further comprising:

a loop electrode coupled to the high-frequency device and directly electrically connected to the radiation electrode;

wherein

the loop electrode is provided at a mounting portion at which the high-frequency device is mounted, such that a loop plane of the loop electrode is arranged substantially in a direction of a plane of the radiation electrode.

5. The wireless IC device according to claim 4, further comprising:

a matching circuit provided between the mounting portion of the high-frequency device and the loop electrode;

wherein

the matching circuit directly electrically connects the high-frequency device with the loop electrode.

6. The wireless IC device according to claim 1, further comprising:

a loop electrode provided at a mounting portion at which the high-frequency device is mounted;

wherein

the loop electrode is coupled to the high-frequency device and is electromagnetically coupled to the radiation electrode via an insulating layer.

7. The wireless IC device according to claim 5, further comprising:

a matching circuit provided between the mounting portion of the high-frequency device and the loop electrode;

wherein

the matching circuit directly electrically connects the high-frequency device with the loop electrode.

8. The wireless IC device according to claim 1, further comprising at least one of a resonant circuit or a matching circuit provided in the power supply circuit substrate.

9. The wireless IC device according to claim 8, wherein a resonant frequency of the resonant circuit substantially corresponds to a frequency of a signal exchanged by the radiation electrode.

10. The wireless IC device according to claim 1, wherein the radiation electrode is a metal film layer of an article package such that a sheet having a conductive layer is arranged in one of a bag shape or a package shape.

11. The wireless IC device according to claim 1, wherein the radiation electrode is an electrode pattern provided on a circuit substrate in an electronic device.

12. The wireless IC device according to claim 1, wherein the radiation electrode is a metal plate provided on a rear surface of a component in an electronic device.

13. The wireless IC device according to claim 1, further comprising:

a resonant conductor having a resonant frequency that is substantially equal to an operating frequency of the high-frequency device;

wherein

the resonant conductor is coupled to the high-frequency device.

14. The wireless IC device according to claim 13, wherein the resonant conductor is arranged substantially parallel to an edge portion of the radiation electrode at which the cutout portion is provided.

15. The wireless IC device according to claim 13, wherein the resonant conductor has a length that is substantially equal to a side of the radiation electrode which the resonant conductor is located adjacent to.

16. The wireless IC device according to claim 13, wherein the resonant conductor is arranged so that a portion of the resonant conductor located adjacent to a location at which the high-frequency device is arranged is located substantially at the center.

17. The wireless IC device according to claim 13, wherein a plurality of the high-frequency devices are provided, and the resonant conductor is coupled to each of the high-frequency devices.

18. The wireless IC device according to claim 13, wherein the resonant conductor is separable from a body that defines the radiation electrode.

19. The wireless IC device according to claim 13, wherein the resonant conductor is provided in a margin portion of a printed wiring substrate.

20. The wireless IC device according to claim 13, wherein one of a casing of an apparatus on which the wireless IC device is mounted or another component mounted on the apparatus defines the resonant conductor.

21. A wireless IC device comprising:

a component including;

a high-frequency device defined by one of an electromagnetic coupling module or a wireless IC chip including a wireless IC and a power supply circuit substrate that is electrically connected or electromagnetically coupled to the wireless IC while being coupled to an external circuit; and

a substrate on which the high-frequency device is mounted and which includes at least two linear electrodes, a first end of each of the at least two linear electrodes being coupled to the high-frequency device; and

an article including a radiation electrode that is electrically connected to the second ends of the at least two linear electrodes to define a loop electrode.

22. A wireless IC device comprising:

a component including;

a high-frequency device defined by one of an electromagnetic coupling module or a wireless IC chip including a wireless IC and a power supply circuit substrate that is electrically connected or electromagnetically coupled to the wireless IC while being coupled to an external circuit; and

a substrate on which the high-frequency device is mounted and which includes at least two linear electrodes, a first end of each of the at least two linear electrodes being coupled to the high-frequency device;

wherein

second ends of the at least two linear electrodes are electrically connected to each other to define a loop electrode; and

an article provided with a conductor that is electrically connected to the loop electrode and defines a radiator.