Simulation system and method for manufacturing printed circuit board

• US 8,249,847 B2
• Filed: 03/10/2008
• Issued: 08/21/2012
• Est. Priority Date: 09/28/2007
• Status: Expired due to Fees

• Current Assignee: Zhen Ding Technology Co. Ltd
• Original Assignee: Fukui Precision Component Company Limited (Hon Hai Precision Industry Co., Ltd.), Zhen Ding Technology Co. Ltd
• Inventors: Zhu, Jin, Wang, Ming, Tu, Chih-Yi
• Primary Examiner(s): KASENGE, CHARLES R
• Application Number:
  US12/045,137
• Publication Number:
  US 20090088881A1
• Time in Patent Office: 1,625 Days
• Field of Search: 700/95, 700/97, 700108-110, 700/117, 700/121, 716/1, 716 4- 6, 716 8- 12, 716/15, 703/1, 703/6, 703/7, 703/13, 703/14, 703/22
• US Class Current: 703/14
• CPC Class Codes: G06F 30/20 Design optimisation, verification or simulation optimisation, verification or simulation of circuit designs G06F30/30
• CPC Class Codes: H05K 13/085 Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level

Abstract

An exemplary simulation system for manufacturing a printed circuit board is provided. The simulation system includes at least one simulation sub-system. The simulation sub-system includes an input module, a storing module, a processing module, and an output module. The input module is configured for acquiring a number of processing parameters associated with steps of a process for manufacturing the printed circuit board. The storing module is configured for storing a number of simulation functions relating to the steps of the process for manufacturing the printed circuit board. The processing module is configured for selecting and performing the corresponding simulation function according to the acquired parameters, thereby obtaining a simulation result. The output module is configured for output the simulation result.

Claims

1. A simulation system for forming electrical traces of a printed circuit board, the simulation system comprising a first simulation sub-system for simulating a first process of laminating a photoresist layer on a conductive layer of a circuit substrate, the first simulation sub-system, comprising:

a first input module configured for acquiring a plurality of processing parameters associated with the first process inputted through a human-computer interface by a user, the processing parameters associated with the first process selected from a group consisting of a temperature of a thermally laminating roller, a pressure of the thermally laminating roller, a transmitting speed of the circuit substrate, and a surface temperature of the circuit substrate;

a first memory configured for storing a plurality of simulation functions relating to the first process;

a first central processing unit configured for selecting and performing the corresponding simulation function according to the input parameters thereby obtaining a simulation result relating to the first process; and

a first output module configured for outputting the simulation result and displaying the simulation result relating to the first process.

2. The simulation system as claimed in claim 1, wherein one of the simulation functions represents a function relationship between the processing parameters of the first process and a plurality of performance parameters of an adhesion force of the photoresist layer laminated to the printed circuit board.

3. The simulation system as claimed in claim 1, further comprising an analyzing module configured for automatically generating a suitable simulation function according to a plurality of simulation results.

4. The simulation system as claimed in claim 3, further comprising a function transmitting module configured for selecting the simulation function generated by the analyzing module and transmitting the selected simulation function to the first memory.

5. The simulation system as claimed in claim 4, wherein the first memory is configured for communicating with the analyzing module and the function transmitting module so that the simulation functions stored in the first memory is updated synchronously.

6. The simulation system as claimed in claim 1, wherein the first memory is either a semiconductor memory or a magnetic memory.

7. The simulation system as claimed in claim 1, further comprising a second simulation sub-system for simulating a second process of exposing the photoresist layer coated on the circuit substrate.

8. The simulation system as claimed in claim 7, wherein the second simulation sub-system comprises:

a second input module configured for acquiring a plurality of processing parameters associated with the second process inputted through the human-computer by the user;

a second memory configured for storing a plurality of simulation functions relating to the second process;

a second central processing unit configured for selecting and performing the corresponding simulation function according to the input parameters thereby obtaining a simulation result relating to the second process; and

a second output module configured for outputting the simulation result relating to the second process and displaying displaying the simulation result relating to the second process.

9. The simulation system as claimed in claim 8, wherein the processing parameters associated with the second process are selected from a group consisting of an exposing time, an intension of light, and performance parameters of the printed circuit board undergoing the first process.

10. The simulation system as claimed in claim 8, further comprising a third simulation sub-system for simulating a third process of developing the photoresist layer into a patterned photoresist layer.

11. The simulation system as claimed in claim 10, wherein the third simulation sub-system comprising:

a third input module configured for acquiring a plurality of processing parameters associated with the third process inputted through the human-computer interface by the user;

a third memory configured for storing a plurality of simulation functions relating to the third process;

a third central processing unit configured for selecting and performing the corresponding simulation function according to the input parameters thereby obtaining a simulation result relating to the third process; and

a third output module configured for outputting the simulation result relating to the third process and displaying the simulation result relating to the third process.

12. The simulation system as claimed in claim 11, wherein the processing parameters associated with the third process are selected from a group consisting of developing time, a concentration of the developing solvent, and performance parameters of the printed circuit board undergoing the second process.

13. The simulation system as claimed in claim 11, further comprising a fourth simulation sub-system for simulating a fourth process of etching a conductive layer of the circuit substrate.

14. The simulation system as claimed in claim 13, wherein the fourth simulation sub-system comprises:

a fourth input module configured for acquiring a plurality of processing parameters associated with the fourth process inputted through a human-computer interface by the user;

a fourth memory configured for storing a plurality of simulation functions relating to the fourth process;

a fourth central processing unit configured for selecting and performing the corresponding simulation function according to the input parameters thereby obtaining a simulation result relating to the fourth process; and

a fourth output module configured for outputting the simulation result relating to the fourth process and displaying the simulation result relating to the fourth process.

15. The simulation system as claimed in claim 14, wherein the processing parameters associated with the fourth process are selected from a group consisting of an etching time, a concentration of the etchant, and performance parameters of the printed circuit board undergoing the third process.

16. A simulation method for forming electrical traces of a printed circuit board, the simulation method comprising:

a first step for simulating a first process of laminating a photoresist layer on a conductive layer of a circuit substrate, the first step comprising;

acquiring a plurality of first processing parameters associated with the first process of laminating a photoresist layer on a conductive layer of a circuit substrate by inputting into a first input module through a human-computer interface;

selecting a first simulation function stored in a memory relating to the first process of laminating a photoresist layer on a conductive layer of a circuit substrate through a first central processing unit;

performing the first simulation function according to the acquired first processing parameters through the first central processing unit, thereby obtaining a first simulation value of the performance parameters of the printed circuit board laminated with the photoresist layer; and

outputting and displaying the first simulation value and displaying the first simulation value on a screen; and

a second step for simulating a second process of exposing the photoresist layer coated on the circuit substrate, the second step comprising;

acquiring a plurality of second processing parameters associated with the second process of exposing the photoresist layer coated on the circuit substrate by inputting into a second input module through a human-computer interface;

selecting a second simulation function stored in the memory relating to the second process of exposing the photoresist layer coated on the circuit substrate through a second central processing unit;

performing the second simulation function according to the acquired second processing parameters through the second central processing unit, thereby obtaining a second simulation value of the performance parameters of the printed circuit board undergoing the exposing step; and

outputting the second simulation value and displaying the second simulation value on a screen.

17. The simulation method as claimed in claim 16, further comprising a third step for simulating a third process of developing the photoresist layer into a patterned photoresist layer, the third step comprising:

acquiring a plurality of third processing parameters associated with the third process of developing the photoresist layer into a patterned photoresist layer by inputting into a third input module through a human-computer interface, and transmitting the second simulation value into the third input module;

selecting a third simulation function stored in the memory relating to the third process of developing the photoresist layer into a patterned photoresist layer through a third central processing unit;

performing the third simulation function according to the acquired third processing parameters through the third central processing unit, thereby obtaining a third simulation value of the performance parameters of the printed circuit board undergoing the exposing step and the developing step; and

outputting the third simulation value and displaying the third simulation value on a screen.

18. The simulation method as claimed in claim 17, further comprising a fourth step for simulating a fourth process of etching a conductive layer of the circuit substrate, the fourth step comprising:

acquiring a plurality of fourth processing parameters associated with the fourth process of etching a conductive layer of the circuit substrate by inputting into a fourth input module through a human-computer interface, and transmitting the third simulation value into the fourth input module;

selecting a fourth simulation function stored in the memory relating to the fourth process of etching a conductive layer of the circuit substrate through a fourth central processing unit;

performing the fourth simulation function according to the acquired fourth processing parameters through the fourth central processing unit, thereby obtaining a fourth simulation value of the performance parameters of the printed circuit board undergoing the exposing step, the developing step, and the etching step; and

outputting the fourth simulation value and displaying the fourth simulation value on a screen.