Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronics

  • US 8,250,921 B2
  • Filed: 07/06/2007
  • Issued: 08/28/2012
  • Est. Priority Date: 07/06/2007
  • Status: Active Grant
First Claim
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1. An inertial measurement unit (IMU) operable to be mounted onto a surface of a board, the IMU comprising:

  • three linear accelerometers, each one of the three accelerometers operable to provide a first measurement output corresponding to a measurement of linear acceleration in one axis, wherein a sensitive axis of each accelerometer is orthogonal to the sensitive axes of the other accelerometers, wherein the three accelerometers being formed on a first silicon substrate;

    three rotation sensors, each one of the three rotation sensors is a vibratory gyroscope with electrostatic actuation and electrostatic sensing operable to provide a second measurement output corresponding to a measurement of rotation about one axis, wherein a sensitive axis of each vibratory gyroscope is orthogonal to the sensitive axis of the other vibratory gyroscopes, wherein the three of vibratory gyroscopes-being formed on the first silicon substrate; and

    an application specific integrated circuit (ASIC) to receive both the first measurement outputs from the three linear accelerometers and the second measurement outputs from the three vibratory gyroscopes, wherein the ASIC includes a computation unit and a memory coupled to the computation unit, wherein the computation unit receives and processes data from the three accelerometers and the three vibratory gyroscopes to track motion in space, the ASIC being implemented on a second silicon substrate,wherein the first silicon substrate is vertically stacked and attached to the second silicon substrate and is substantially parallel to the second silicon substrate, the first silicon substrate being electrically connected to the second silicon substrate to form a single semiconductor chip.

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