Circuit board laminated module and electronic equipment

• US 8,254,144 B2
• Filed: 12/16/2010
• Issued: 08/28/2012
• Est. Priority Date: 12/25/2009
• Status: Expired due to Fees

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Matsumoto, Katsuji, Yanagawa, Shusaku, Oka, Shuichi, Rokuhara, Shinji
• Primary Examiner(s): Dinh, Tuan T
• Assistant Examiner(s): DANG, HUNG Q
• Application Number:
  US12/926,901
• Publication Number:
  US 20110157857A1
• Time in Patent Office: 621 Days
• Field of Search: 361/803, 361/818, 361/600, 361/780, 257/659, 257/686, 257/773, 257/777, 257/685, 257/668
• US Class Current: 361/803
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/0224 Patterned shielding planes, ground planes or power planes H05K1/0253 takes precedence
• CPC Class Codes: H05K 1/0243 Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/165 incorporating printed inductors

Abstract

A circuit board laminated module includes: a first circuit board having a multi-layer structure in which ground layers are provided in a plurality of layers; a second circuit board mounted on the first circuit board; and a semiconductor chip mounted on the second circuit board, wherein in the first circuit board, a noise guiding through via which guides an electromagnetic noise generated in the semiconductor chip to a lower layer side is provided on a side different from a circuit portion or a circuit element desired to be protected against influence of the electromagnetic noise in a surrounding direction of an occurrence place of the electromagnetic noise.

Claims

1. A circuit board laminated module, comprising:

a first circuit board having a multi-layer structure in which ground layers are provided in a plurality of layers;

a second circuit board mounted on the first circuit board; and

a semiconductor chip mounted on the second circuit board, wherein

in the first circuit board, a noise guiding through via which guides an electromagnetic noise generated in the semiconductor chip to a lower layer side is provided on a side different from a circuit portion or a circuit element desired to be protected against influence of the electromagnetic noise in a surrounding direction of an occurrence place of the electromagnetic noise,

a plurality of layers of the second circuit board include at least one ground layer electrically connected to the ground layer of the first circuit board provided with the noise guiding through via,

the circuit element includes a laminate inductor formed using the wiring layer of the second circuit board, and

in a region below the laminate inductor, openings larger than an area of the laminate inductor are formed in all ground layers of ground layers of the second circuit board and the ground layers of the first circuit board except for a rear surface ground layer of a lowermost layer of the first circuit board.

2. A circuit board laminated module, comprising:

a first circuit board having a multi-layer structure in which ground layers are provided in a plurality of layers,

a second circuit board mounted on the first circuit board; and

a semiconductor chip mounted on the second circuit board, wherein

in the first circuit board, a noise guiding through via which guides an electromagnetic noise generated in the semiconductor chip to a lower layer side is provided on a side different from a circuit portion or a circuit element desired to be protected against influence of the electromagnetic noise in a surrounding direction of an occurrence place of the electromagnetic noise,

the circuit element includes a laminate inductor formed using a wiring layer of the second circuit board, and

in a region below the laminate inductor, openings larger than an area of the laminate inductor are formed in all ground layers of ground layers of the second circuit board and the ground layers of the first circuit board except for a rear surface ground layer of a lowermost layer of the first circuit board.

3. The circuit board laminated module according to claim 2, wherein a diameter of the noise guiding through via is equal to or smaller than a diameter of a through hole of a through via to connect circuit wirings of different layers.

4. The circuit board laminated module according to claim 3, further comprising a plurality of circuit elements which are external elements of the semiconductor chip, are arranged on the second circuit board, and are formed using a substrate wiring layer, wherein

the noise guiding through via is provided, with respect to the occurrence place of the electromagnetic noise, on a side opposite to an arrangement center where a specific circuit element of the plurality of circuit elements, to which the electromagnetic noise is applied when the noise guiding through via does not exist, is arranged.

5. The circuit board laminated module according to claim 4, wherein the plurality of noise guiding through vias are provided on the side opposite to the arrangement center where the specific circuit element is arranged, and are spaced from each other.

6. The circuit board laminated module according to claim 3, further comprising a plurality of circuit elements which are external elements of the semiconductor chip, are arranged on the second circuit board, and are formed using a substrate wiring layer, wherein

the noise guiding through via is provided, with respect to the occurrence place of the electromagnetic noise, on a side opposite to an arrangement center of the circuit element closest to the occurrence place.

7. The circuit board laminated module according to claim 6, wherein the plurality of noise guiding through vias are spaced from each other and are provided, with respect to the occurrence place of the electromagnetic noise, on a side which is an arrangement center and is opposite to an arrangement center where the one circuit element of the plurality of circuit elements closest to the occurrence place of the electromagnetic noise is arranged.

8. The circuit board laminated module according to claim 7, wherein a plurality of layers of the second circuit board include at least one ground layer electrically connected to the ground layer of the first circuit board provided with the noise guiding through via.