Method for dicing substrate

  • US 8,268,704 B2
  • Filed: 03/06/2003
  • Issued: 09/18/2012
  • Est. Priority Date: 03/12/2002
  • Status: Active Grant
First Claim
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1. A substrate dividing method comprising the steps of:

  • irradiating a laser light incident face of a substrate with laser light while positioning a light-converging point within the substrate, thereby forming a modified region embedded within the substrate along each line of a plurality of cutting lines arranged in a grid with respect to the substrate, the substrate having a front face and a rear face through the substrate, the front face of the substrate being formed with at least one functional device, and each modified region forming a starting point region configured for cutting the substrate inside the substrate at a predetermined distance from the laser light incident face of the substrate;

    grinding the rear face of the substrate after the step of forming the starting point regions, wherein the substrate comprises at least a portion of each modified region after completion of the grinding step; and

    dividing the substrate, wherein the substrate is divided when a fracture generated in a thickness direction of the substrate from each starting point region reaches the front face and the rear face of the substrate.

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