LED lighting device with thermally conductive resin lampstand

• US 8,277,109 B2
• Filed: 06/06/2009
• Issued: 10/02/2012
• Est. Priority Date: 06/09/2008
• Status: Expired due to Fees

• Current Assignee: Ledray Tech. Co.,Ltd.
• Original Assignee: Ledray Technology Company Limited
• Inventors: Ko, Chiu-Shuang
• Primary Examiner(s): Negron, Ismael
• Application Number:
  US12/479,764
• Publication Number:
  US 20090303719A1
• Time in Patent Office: 1,214 Days
• Field of Search: 362/612, 362/555, 362/545, 362/547, 362647-659, 362/249.02, 362/294, 362/373
• US Class Current: 362/647
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21V 23/002 Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
• CPC Class Codes: F21V 29/745 the fins or blades being planar and inclined with respect to the joining surface from which the fins or blades extend
• CPC Class Codes: F21V 29/75 with fins or blades having different shapes, thicknesses or spacing
• CPC Class Codes: F21V 29/767 the planes containing the fins or blades having directions perpendicular to the light emitting axis
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/4903 Connectors having different sizes, e.g. different diameters
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/19107 off-chip wires

Abstract

A LED lighting device includes a cooling lampstand, a circuit, at least one light emitting diode (LED), a sealant and a power converter. The cooling lampstand is made by a resin composition in which the thermal conductivity of the resin composition is about 1-50 W/mk. The circuit directly is disposed on the cooling lampstand. The light emitting diode (LED) is disposed on the cooling lampstand and electrically connected to the circuit. The sealant covers the LED. The power converter is electrically connected to the circuit for supplying an electrical power to the circuit.

Claims

1. A LED lighting device with thermally conductive resin lampstand comprising:

a cooling lampstand comprised of a resin composition, wherein the thermal conductivity of the resin composition is about 1-50 W/mK;

a circuit directly disposed on the cooling lampstand;

at least one light emitting diode (LED) disposed on the cooling lampstand and electrically connected to the circuit;

a sealant directly disposed on the lampstand and fully covering the at least one LED; and

a power converter electrically connected to the circuit for supplying an electrical power to the circuit.

2. The LED lighting device with thermally conductive resin lampstand of claim 1, wherein the cooling lampstand is made out of one piece by the resin composition.

3. The LED lighting device with thermally conductive resin lampstand of claim 1, wherein the LED is an LED die or an LED package.

4. The LED lighting device with thermally conductive resin lampstand of claim 1, wherein the resin composition comprises a plurality of thermal-conductive particles therein.

5. The LED lighting device with thermally conductive resin lampstand of claim 1, wherein the power converter is embedded in the cooling lampstand.

6. The LED lighting device with thermally conductive resin lampstand of claim 1, wherein the resin composition is made from three ingredients:

the first ingredient is selected from the group consisting of polybutylene terephthalate (PBT), polyarylene sulfide, liquid crystal polymer, syndiotactic polystyrene (SPS), polyphthalamide, and a combination thereof;

wherein, the first ingredient in the resin composition is 20.about.65 wt %;

the second ingredient is selected from the group consisting of aluminum oxide, magnesium oxide, silicon carbide, boron nitride, and a combination thereof;

wherein, the second ingredient in the resin composition is 15.about.60 wt %; and

the third ingredient is selected from the group consisting of glass fibers, carbon fibers, and a combination thereof;

wherein, the third ingredient in the resin composition is 5.about.45 wt %.

7. The LED lighting device with thermally conductive resin lampstand of claim 1, wherein the resin composition is made from three ingredients:

the first ingredient is an aromatic polycarbonate oligomer, wherein the first ingredient in the resin composition is 1-40 parts by weight;

the second ingredient is a graphitized carbon fiber, wherein the second ingredient in the resin composition is 5-40 parts by weight; and

the third ingredient is a plurality of boron nitride particles, wherein the third ingredient in the resin composition is 5-100 parts by weight.

8. The LED lighting device of claim 1, wherein:

the circuit is directly disposed on the cooling lampstand without using a circuit board.

9. The LED lighting device of claim 1, wherein:

at least a portion of the power converter is surrounded by the lampstand.

10. The LED lighting device with thermally conductive resin lampstand of claim 1, further comprising a plurality of the LEDs that are electrically connected together in series or in parallel.

11. The LED lighting device with thermally conductive resin lampstand of claim 10, wherein two electrodes of the LED are located at the same terminal of the LED.

12. The LED lighting device with thermally conductive resin lampstand of claim 1, wherein:

the lampstand has an indentation zone; and

the sealant is in the indentation zone.

13. The LED lighting device with thermally conductive resin lampstand of claim 12, wherein:

a depth of the indentation zone is less than or equal to 2 mm.

14. A LED lighting device with thermally conductive resin lampstand comprising:

a cooling lampstand having an indentation zone and made by a resin composition, wherein the thermal conductivity of the resin composition is about 1-50 W/mK;

a circuit directly disposed on the cooling lampstand;

at least one light emitting diode (LED) disposed on the cooling lampstand and electrically connected to the circuit;

a sealant filling the indentation zone and fully covering the at least one LED; and

a power converter electrically connected to the circuit for supplying an electrical power to the circuit, at least a portion of the power converter is surrounded by the lampstand.