Integrated antennas in wafer level package
First Claim
Patent Images
1. A semiconductor module configured to electrically or mechanically couple to an external substrate, comprising:
- a package molding compound layer comprising an integrated circuit (IC) device embedded within a package molding compound; and
an interface layer separate from the external substrate, abutting the package molding compound layer, wherein the interface layer comprisesa redistribution layer coupled to the IC device for connecting the IC device externally, wherein the interface layer is disposed between the package molding compound layer and the external substrate;
at least one integrated antenna structure within the interface layer and coupled to the IC device.
1 Assignment
0 Petitions
Accused Products
Abstract
A semiconductor module comprises components in one wafer level package. The module comprises an integrated circuit (IC) chip embedded within a package molding compound. The package comprises a molding compound package layer coupled to an interface layer for integrating an antenna structure and a bonding interconnect structure to the IC chip. The bonding interconnect structure comprises three dimensional interconnects. The antenna structure and bonding interconnect structure are coupled to the IC chip and integrated within the interface layer in the same wafer fabrication process.
51 Citations
14 Claims
-
1. A semiconductor module configured to electrically or mechanically couple to an external substrate, comprising:
-
a package molding compound layer comprising an integrated circuit (IC) device embedded within a package molding compound; and an interface layer separate from the external substrate, abutting the package molding compound layer, wherein the interface layer comprises a redistribution layer coupled to the IC device for connecting the IC device externally, wherein the interface layer is disposed between the package molding compound layer and the external substrate; at least one integrated antenna structure within the interface layer and coupled to the IC device. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
-
8. A semiconductor module configured to electrically or mechanically couple to an external substrate, comprising:
-
a first package molding compound layer comprising an integrated circuit (IC) device embedded within the first package molding compound layer; an interface layer separate from the external substrate, abutting the first package molding compound layer, wherein the interface layer comprises; a redistribution layer coupled to the IC device; and at least one antenna structure integrated from within the interface layer and coupled to the IC device; and a second package molding compound layer comprised of a second package molding compound, abutting the first package molding compound layer and the interface layer. - View Dependent Claims (9, 10, 11, 12, 13, 14)
-
Specification