Method and system for an integrated leaky wave antenna-based transmitter and on-chip power distribution

• US 8,285,231 B2
• Filed: 12/30/2009
• Issued: 10/09/2012
• Est. Priority Date: 06/09/2009
• Status: Expired due to Fees

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Rofougaran, Ahmadreza, Rofougaran, Maryam
• Primary Examiner(s): LE, NHAN T
• Application Number:
  US12/650,292
• Publication Number:
  US 20100308651A1
• Time in Patent Office: 1,014 Days
• Field of Search: 455/115.1, 455/115.2, 455/115.3, 455/127.1, 455/127.5, 455/129, 455/333, 455/341, 343/700.MS
• US Class Current: 455/129
• CPC Class Codes: G01S 13/06 Systems determining position data of a target
• CPC Class Codes: G06K 7/10316 using at least one antenna particularly designed for interrogating the wireless record carriers antennas in general H01Q1/22
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 13/20 Non-resonant leaky-waveguide or transmission-line antennas; Equivalent structures causing radiation along the transmission path of a guided wave
• CPC Class Codes: H01Q 13/22 Longitudinal slot in boundary wall of waveguide or transmission line H01Q13/203 takes precedence
• CPC Class Codes: H01Q 15/006 Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
• CPC Class Codes: H01Q 15/0066 said selective devices being reconfigurable, tunable or controllable, e.g. using switches
• CPC Class Codes: H01Q 15/23 Combinations of reflecting surfaces with refracting or diffracting devices
• CPC Class Codes: H01Q 19/06 using refracting or diffracting devices, e.g. lens radome H01Q1/42
• CPC Class Codes: H04B 1/0458 Arrangements for matching and coupling between power amplifier and antenna or between amplifying stages matching circuits in general H03H
• CPC Class Codes: H04B 5/72 for local intradevice communication
• CPC Class Codes: H04B 7/24 for communication between two or more posts wireless communication networks H04W

Abstract

Methods and systems for an integrated leaky wave antenna-based transmitter and on-chip power distribution are disclosed, and may include supplying one or more bias voltages and ground for a chip including a plurality of power amplifiers (PAs) utilizing bias voltage and ground lines. One or more leaky wave antennas (LWAs) may be communicatively coupled to the power amplifiers. Wireless signals may be transmitted utilizing the LWAs integrated in the lines in the chip. Radio frequency (RF) signals may be transmitted via the plurality of LWAs. The RF signals may include 60 GHz signals and the LWAs may include microstrip and/or coplanar waveguides. A cavity length of the LWAs may be configured by a spacing between conductive lines in the microstrip and/or coplanar waveguides. The LWAs may be configured to transmit the wireless signals at a desired angle from a surface of the chip.

Claims

1. A method for communication, the method comprising:

performing using one or more circuits in a wireless device, said one or more circuits comprising a plurality of power amplifiers on a chip, wherein each of said plurality of power amplifiers is communicatively coupled to one or more leaky wave antennas, said one or more leaky wave antennas being integrated in power supply voltage and ground lines to said chip;

supplying one or more power supply voltages and ground to said chip utilizing said power supply voltage and ground lines, respectively; and

transmitting wireless signals utilizing said leaky wave antennas integrated in said power supply voltage and ground lines in said chip.

2. The method according to claim 1, comprising transmitting radio frequency (RF) signals via said plurality of leaky wave antennas.

3. The method according to claim 2, wherein said RF signals comprise 60 GHz signals.

4. The method according to claim 1, wherein said leaky wave antennas comprise microstrip waveguides.

5. The method according to claim 4, wherein a cavity length of said leaky wave antennas is dependent on a spacing between conductive lines in said microstrip waveguides.

6. The method according to claim 1, wherein said leaky wave antennas comprise coplanar waveguides.

7. The method according to claim 6, wherein a cavity length of said leaky wave antennas is dependent on a spacing between conductive lines in said coplanar waveguides.

8. The method according to claim 1, comprising configuring said leaky wave antennas to transmit said wireless signals at a desired angle from a surface of said chip.

9. The method according to claim 1, comprising amplifying signals for said transmitting using said plurality of power amplifiers.

10. The method according to claim 1, comprising configuring a gain of said plurality power amplifiers for a desired transmitted output power.

11. A system for enabling communication, the system comprising:

one or more circuits in a wireless device, said one or more circuits comprising a plurality of power amplifiers on a chip, wherein each of said power amplifiers is communicatively coupled to one or more leaky wave antennas, said one or more leaky wave antennas being integrated in power supply voltage and ground lines to said chip, said one or more circuits being operable to;

supply one or more power supply voltages and ground to said chip utilizing said power supply voltage and ground lines, respectively; and

transmit wireless signals utilizing said leaky wave antennas integrated in said power supply voltage and ground lines in said chip.

12. The system according to claim 11, wherein said one or more circuits are operable to transmitting radio frequency (RF) signals via said plurality of leaky wave antennas.

13. The system according to claim 12, wherein said one or more circuits are operable to wherein said RF signals comprise 60 GHz signals.

14. The system according to claim 11, wherein said leaky wave antennas comprise microstrip waveguides.

15. The system according to claim 14, wherein a cavity length of said leaky wave antennas is dependent on a spacing between conductive lines in said microstrip waveguides.

16. The system according to claim 11, wherein said leaky wave antennas comprise coplanar waveguides.

17. The system according to claim 16, wherein a cavity length of said leaky wave antennas is dependent on a spacing between conductive lines in said coplanar waveguides.

18. The system according to claim 11, wherein said one or more circuits are operable to configure said leaky wave antennas to transmit said wireless signals at a desired angle from a surface of said chip.

19. The system according to claim 11, wherein said one or more circuits are operable to amplify signals for said transmitting using said plurality of power amplifiers.

20. The system according to claim 11, wherein a gain of said plurality power amplifiers is configured for a desired transmitted output power.