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Flexible biomonitor with EMI shielding and module expansion

  • US 8,287,451 B2
  • Filed: 06/13/2008
  • Issued: 10/16/2012
  • Est. Priority Date: 05/19/2005
  • Status: Active Grant
First Claim
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1. A flexible biomonitor configured for sensing and monitoring temperature and a plurality of physiological phenomenon signals, comprising:

  • a flexible substrate having a circuit apparatus, formed on the flexible substrate, the circuit apparatus having a circuit layout mounted thereon and further comprising;

    a bottom circuit layer, connected with one side of the flexible substrate;

    a top circuit layer connected with the other side of the flexible substrate, and being electrically connected with the bottom circuit layer;

    a plurality of through holes, wherein each through hole passes through the flexible substrate and is filled with a conducting material for enabling electric current to pass between components on the top circuit layer and components on the lower circuit board;

    a hybrid sensor being disposed on the bottom circuit layer configured for sensing at least a temperature signal and a physiological phenomenon to generate a signal indicative of the sensed temperature and physiological phenomenon;

    a plurality of IC devices disposed on the top circuit layer configured for performing signal processing on the signal to generate a processed signal indicative of at least the sensed temperature and physiological phenomenon;

    a central processing module disposed on the top circuit layer configured for performing signal processing on the processed signal to generate a hybrid signal for wireless transmission of said hybrid signal;

    at least a pair of flexible wing circuit boards, each pair of flexible wing circuit boards having at least a RF transmitter circuit or an antenna disposed thereon, wherein each pair of flexible wing circuit boards are disposed separated from the circuit apparatus while being discretely coupled to the circuit apparatus through a pair of pads attached to the circuit apparatus using conductive adhesive, to transmit the hybrid signal to a remote receiver by said wireless transmission, wherein a first pad of each pair of pads is coupled to the top circuit layer and a second pad of each pair of pads is coupled to the bottom circuit layer; and

    a power supply electrically connected with the circuit apparatus for supplying electric power to the circuit apparatus, the hybrid sensor, the IC devices, the central processing module, the RF transmitter circuit and the antenna.

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