Light-emitting diode packaging structure and module and assembling method thereof

• US 8,294,263 B2
• Filed: 05/31/2011
• Issued: 10/23/2012
• Est. Priority Date: 12/31/2007
• Status: Active Grant

• Current Assignee: Everlight Electronics Company Limited
• Original Assignee: Everlight Electronics Company Limited
• Inventors: Pei, Chien-Chang, Sheu, Sheng-Jia
• Primary Examiner(s): Rodela, Eduardo A
• Application Number:
  US13/149,309
• Publication Number:
  US 20110254025A1
• Time in Patent Office: 511 Days
• Field of Search: 257/688, 257/726, 257/785, 257/E33.071, 257/E33.062, 257/E33.066, 174/545, 174/555, 174/561, 174/562, 174/563, 439/55, 439/358
• US Class Current: 257/726
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light-emitting diode packaging structure comprises a light-emitting diode and first and second metal plates on which the light-emitting diode is mounted. The light-emitting diodes includes first and second electrode leads, the second electrode lead having first and second contact surfaces on an outer edge of the second electrode lead. The first metal plate includes at least one clamping portion that clamps and fixes the first electrode lead on the first metal plate. The second metal plate includes at least first and second clamping portions. The first contact surface of the second electrode lead contacts the first clamping portion, and the second contact surface of the second electrode lead contacts the second clamping portion, such that the light-emitting diode is fixed on the second metal plate in at least two dimensions parallel to a primary surface of the second metal plate on which the light-emitting diodes is mounted.

Claims

1. A light-emitting diode packaging structure, comprising:

a light-emitting diode including a first electrode lead and a second electrode lead, the second electrode lead having a first contact surface and a second contact surface on an outer edge of the second electrode lead;

a first metal plate having a primary surface on which the first electrode lead is mounted, the first metal plate including a third clamping portion and a fourth clamping portion that clamp and fix the first electrode lead on the first metal plate; and

a second metal plate having a primary surface on which the second electrode lead is mounted, the second metal plate including at least a first clamping portion and a second clamping portion, the first contact surface of the second electrode lead contacting the first clamping portion and the second contact surface of the second electrode lead contacting the second clamping portion such that the light-emitting diode is fixed on the second metal plate in at least two dimensions parallel to the primary surface of the second metal plate,

wherein each of the electrode leads includes at least one position hole, and wherein each of the metal plates further includes at least one holding portion corresponding to the position hole to pass through the position hole and hold the respective electrode lead thereon.

2. The light-emitting diode packaging structure as recited in claim 1, wherein the first clamping portion and the second clamping portion are arranged such that an angle is formed between the first clamping portion and the second clamping portion.

3. The light-emitting diode packaging structure as recited in claim 2, wherein the angle is 90 degrees.

4. The light-emitting diode packaging structure as recited in claim 1, wherein the first electrode lead has a third contact surface and a fourth contact surface on an outer edge of the first electrode lead, the third contact surface of the first electrode lead contacting the third clamping portion and the fourth contact surface of the first electrode lead contacting the fourth clamping portion such that the light-emitting diode is fixed on the first metal plate in at least two dimensions parallel to the primary surface of the first metal plate.

5. The light-emitting diode packaging structure as recited in claim 1, wherein the electrode leads are made of Al, Cu or Fe.

6. The light-emitting diode packaging structure as recited in claim 1, wherein each of the clamping portions is formed as one piece together with the respective metal plate.

7. The light-emitting diode packaging structure as recited in claim 1, wherein each holding portion is formed as one piece together with the respective metal plate.

8. The light-emitting diode packaging structure as recited in claim 1, further comprising an electrically conductive bonding material disposed between at least one of the electrode leads and the respective metal plate.

9. The light-emitting diode packaging structure as recited in claim 8, wherein the electrically conductive bonding material is an electrically conductive glue or an Ag glue.

10. A light-emitting diode packaging module, comprising:

a plurality of light-emitting diodes, each of the light-emitting diodes respectively including a first electrode lead and a second electrode lead;

a first metal plate having a primary surface on which the first electrode leads of the light-emitting diodes are mounted, the first metal plate including a plurality of first clamping portions such that at least one of the first clamping portions corresponds to the first electrode lead of each of the light-emitting diodes to clamp and fix the first electrode leads of the light-emitting diodes on the first metal plate; and

a second metal plate having a primary surface on which the second electrode leads of the light-emitting diodes are mounted, the second metal plate including a plurality of second clamping portions such that at least two of the second clamping portions correspond to the second electrode lead of at least one of the light-emitting diodes to clamp and fix the second electrode leads of the light-emitting diodes on the second metal plate,

wherein each of the electrode leads includes at least one position hole, and wherein each of the metal plates further includes a plurality of holding portions each of which corresponding to the position hole of a respective one of the electrode leads to pass through the position holes and hold the electrode leads thereon.

11. The light-emitting diode packaging module as recited in claim 10, wherein the at least two of the second clamping portions are arranged such that a first angle is formed between the at least two of the second clamping portions.

12. The light-emitting diode packaging module as recited in claim 11, wherein the first angle is 90 degrees.

13. The light-emitting diode packaging module as recited in claim 10, wherein at least two of the first clamping portions of the first metal plate correspond to the first electrode lead of one of the light-emitting diodes to clamp and fix the one of the light-emitting diodes, wherein the at least two of the first clamping portions are arranged such that a second angle is formed between the at least two of the first clamping portions.

14. The light-emitting diode packaging module as recited in claim 13, wherein the second angle is 90 degrees.

15. The light-emitting diode packaging module as recited in claim 10, wherein the metal plates are allowed to be bent to form a predetermined three-dimensional structure.

16. The light-emitting diode packaging module as recited in claim 10, wherein the clamping portions of each of the metal plates are formed as one piece together with the respective metal plate.

17. The light-emitting diode packaging module as recited in claim 10, wherein the holding portions of each of the metal plates are formed as one piece together with the respective metal plate.

18. The light-emitting diode packaging module as recited in claim 10, further comprising an electrically conductive bonding material disposed between at least one of the electrode leads and the respective metal plate.