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Packaging material with electromagnetic coupling module

  • US 8,299,968 B2
  • Filed: 08/06/2009
  • Issued: 10/30/2012
  • Est. Priority Date: 02/06/2007
  • Status: Active Grant
First Claim
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1. A packaging material with an electromagnetic coupling module comprising:

  • a packaging material including a liner, and a core material connected to the liner; and

    an electromagnetic coupling module including a radio IC chip and a feeder circuit board on which the radio IC chip is mounted, the feeder circuit board including a resonant circuit that includes an inductance element and has a predetermined resonant frequency;

    whereinthe electromagnetic coupling module is arranged inside of the packaging material; and

    at least one of the liner or the core material is a dielectric, the feeder circuit board being electromagnetically coupled with the at least one of the liner or the core material which is the dielectric, and arranged to radiate a transmission signal supplied from the resonant circuit through electromagnetic coupling and/or to supply the resonant circuit with a received reception signal through the electromagnetic coupling.

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