Apparatus for preparing an antenna for use with a wireless communication device

• US 8,302,289 B2
• Filed: 12/11/2009
• Issued: 11/06/2012
• Est. Priority Date: 04/24/2002
• Status: Expired due to Term

• Current Assignee: Mineral Lassen LLC (Intellectual Ventures LLC)
• Original Assignee: Mineral Lassen LLC (Intellectual Ventures LLC)
• Inventors: Forster, Ian J., King, Patrick F.
• Primary Examiner(s): TRINH, MINH N
• Application Number:
  US12/636,136
• Publication Number:
  US 20100089891A1
• Time in Patent Office: 1,061 Days
• Field of Search: 297/29, 297/39, 297/40, 295/641, 296/00, 296/01, 343/700.MS, 343/767, 3405721-5725
• US Class Current: 29/729
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01Q 9/285 Planar dipole H01Q9/065 takes precedence; patch antenna H01Q9/0407
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 3/041 by using a die for cutting the conductive material
• CPC Class Codes: H05K 3/326 the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence
• CPC Class Codes: Y10T 156/1075 of plural laminae from single stock and assembling to each other or to additional lamina
• CPC Class Codes: Y10T 156/1097 Lamina is running length web
• CPC Class Codes: Y10T 29/49 Method of mechanical manufacture
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 with other electrical component
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/49124 : On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 : by metal fusion
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49751 : Scrap recovering or utilizing
• CPC Class Codes: Y10T 29/49755 : Separating one material from another
• CPC Class Codes: Y10T 29/5137 : including assembling or disassembling station
• CPC Class Codes: Y10T 29/5139 : and means to sever work prior to disassembling
• CPC Class Codes: Y10T 29/514 : comprising means to strip insulation from wire
• CPC Class Codes: Y10T 29/5313 : Means to assemble electrical device
• CPC Class Codes: Y10T 29/53165 : Magnetic memory device
• CPC Class Codes: Y10T 29/5317 : Laminated device
• CPC Class Codes: Y10T 29/53174 : Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 29/53178 : Chip component
• CPC Class Codes: Y10T 29/532 : Conductor
• CPC Class Codes: Y10T 29/53265 : with work-holder for assembly
• CPC Class Codes: Y10T 83/7868 : Tool element selectively operative

Abstract

An apparatus for manufacturing wireless communication devices for use in tracking or identifying other items uses cutting techniques that allow the size of an antenna for the wireless communication device to vary. Further, the chip for the wireless communication device is nested so as to be flush with the surface of the substrate of the wireless communication device. Rollers cut the tabs that form the antenna elements. In a first embodiment, a plurality of rollers are used, each one effecting a different cut whose position may be phased so as to shorten or lengthen the antenna element. In a second embodiment, the rollers are independently positionable to shorten or lengthen the antenna element.

Claims

1. An apparatus for accepting passage of a conductive material to prepare an antenna for use with a wireless communication device, the apparatus comprising:

a first die cut roller configured to make a first cut in the conductive material, the first cut defining a portion of a perimeter of one or more antenna tabs; and

a second die cut roller configured to make a second cut in the conductive material, the second cut defining a portion of the perimeter of the one or more antenna tabs, wherein the second cut overlaps the first cut to cut the perimeter of the one or more antenna tabs;

wherein the overlap of the cuts made by the first die cut roller and the second die cut roller is adjustable to vary the size of the perimeter of the one or more antenna tabs cut by the die cut rollers.

2. The apparatus of claim 1, wherein the first die cut roller and the second die cut roller are respectively configured to make the first and second cuts in a conductive material that is a copper foil.

3. The apparatus of claim 1, wherein the first die cut roller and the second die cut roller are respectively configured to make the first and second cuts in a conductive material that is an aluminum foil.

4. The apparatus of claim 1 wherein the conductive material is secured to an adhesive backing, and wherein the first die cut roller and the second die cut roller are positioned such that the die cut rollers are spaced from the adhesive backing by the conductive material.

5. The apparatus of claim 4, further comprising a waste roller configured to remove conductive material from outside the perimeter of the one or more antenna tabs and from the adhesive backing.

6. The apparatus of claim 1, further comprising a radiator configured to measure an electrical characteristic of a substrate, wherein the overlap of the cuts made by the first die cut roller and the second die cut roller is adjustable based on the measured electrical characteristic of the substrate.

7. The apparatus of claim 1, further comprising a low signal level, low-frequency radiator configured to assess an electrical characteristic of the one or more antenna tabs, wherein the overlap of the cuts made by the first die cut roller and the second die cut roller is adjustable to provide one or more antenna tabs having a selected optimum read range at a desired operating frequency based on the assessed electrical characteristic of the one or more antenna tabs.

8. The apparatus of claim 1, further comprising a heater configured to heat pins of a wireless communication chip to he coupled to the one or more antenna tabs.

9. The apparatus of claim 8, further comprising a pressure roller configured to mate the pins of the wireless communication chip with fingers on the one or more antenna tabs and with a substrate so that the fingers on the one or more antenna tabs wrap around the pins.

10. The apparatus of claim 1, further comprising a welder configured to weld pins of a wireless communication chip to the one or more antenna tabs.

11. The apparatus of claim 10, wherein the welder is further configured to weld the pins of the wireless communication chip with a low-voltage, high-current electrical pulse.

12. The apparatus of claim 11, wherein the welder is further configured to pass the low-voltage, high-current electrical pulse through the pins of the wireless communication chip.

13. The apparatus of claim 1, wherein the overlap of the cuts made by the first die cut roller and the second die cut roller is adjustable based on a desired capacitance of the one or more antenna tabs.

14. The apparatus of claim 13, wherein the relative phases of the first die cut roller and the second die cut roller are adjustable based on the desired capacitance of the one or more antenna tabs.

15. An apparatus for preparing an antenna for use with a wireless communication device, the apparatus comprising:

means for making a first cut in a conductive material passed through the apparatus, the first cut defining a portion of a perimeter of one or more antenna tabs; and

means for making a second cut in the conductive material, the second cut defining a portion of the perimeter of the one or more antenna tabs, wherein the second cut overlaps the first cut to form the one or more antenna tabs;

wherein the means for making the first cut and the means for making the second cut are adjustable to vary the overlap of the first cut and the second cut, thereby varying a size of the perimeter of the one or more antenna tabs.

16. The apparatus of claim 15, wherein the apparatus further comprises means for removing conductive material from outside the perimeter of the one or more antenna tabs and from an adhesive backing.

17. The apparatus of claim 15, further comprising means for measuring an electrical characteristic of a substrate, wherein the overlap of the first cut and the second cut is adjustable based on the electrical characteristic of the substrate.

18. The apparatus of claim 15, further comprising means for heating pins of a wireless communication chip to be coupled to the one or more antenna tabs.

19. The apparatus of claim 18, further comprising means for mating the heated pins of the wireless communication chip with fingers on the one or more antenna tabs and with a substrate so that the fingers on the one or more antenna tabs wrap around the pins.

20. The apparatus of claim 15, further comprising means for welding pins of a wireless communication chip to the one or more antenna tabs.