Apparatus and method for microfabricated multi-dimensional sensors and sensing systems
First Claim
1. A monitoring device, comprising:
- a. a power source;
b. wireless communication equipment; and
c. at least one sensor or sensing system utilizing microelectromechanical systems (MEMS) technology that consumes less than 500 μ
W of power;
wherein data gathered from the at least one sensor or sensing system is transferred by the wireless communication equipment to a central communication hub;
wherein the at least one sensor or sensing system comprises a microelectromechanical nano-sensor platform having;
a substrate including a surface with a first insulating surface layer, wherein the first insulating surface layer is an integral part of the substrate or disposed on the surface of the substrate;
a microstructure first conductive layer deposited in one or more patterns on the surface to make more than one device or electrode;
a second insulation layer, wherein the second insulation layer is configured such that it covers at least some portion of the first conductive layer'"'"'s one or more patterns anda second conductive layer deposited in one or more patterns on the second insulation layer to form devices or electrodes, wherein the devices can be utilized for sensing; and
one or more functionalization layers deposited on at least some portion of the one or more patterns of the second conductive layer, wherein the functionalization layers are adapted to provide one or more transducer sensor classes selected from the group consisting of;
radiant, electrochemical, electronic, mechanical, magnetic and/or thermal devices.
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Accused Products
Abstract
A universal microelectromechanical (MEMS) nano-sensor platform having a substrate and conductive layer deposited in a pattern on the surface to make several devices at the same time, a patterned insulation layer, wherein the insulation layer is configured to expose one or more portions of the conductive layer, and one or more functionalization layers deposited on the exposed portions of the conductive layer to make multiple sensing capability on a single MEMS fabricated device. The functionalization layers are adapted to provide one or more transducer sensor classes selected from the group consisting of: radiant, electrochemical, electronic, mechanical, magnetic, and thermal sensors for chemical and physical variables and producing more than one type of sensor for one or more significant parameters that need to be monitored.
25 Citations
21 Claims
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1. A monitoring device, comprising:
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a. a power source; b. wireless communication equipment; and c. at least one sensor or sensing system utilizing microelectromechanical systems (MEMS) technology that consumes less than 500 μ
W of power;wherein data gathered from the at least one sensor or sensing system is transferred by the wireless communication equipment to a central communication hub; wherein the at least one sensor or sensing system comprises a microelectromechanical nano-sensor platform having; a substrate including a surface with a first insulating surface layer, wherein the first insulating surface layer is an integral part of the substrate or disposed on the surface of the substrate; a microstructure first conductive layer deposited in one or more patterns on the surface to make more than one device or electrode; a second insulation layer, wherein the second insulation layer is configured such that it covers at least some portion of the first conductive layer'"'"'s one or more patterns and a second conductive layer deposited in one or more patterns on the second insulation layer to form devices or electrodes, wherein the devices can be utilized for sensing; and one or more functionalization layers deposited on at least some portion of the one or more patterns of the second conductive layer, wherein the functionalization layers are adapted to provide one or more transducer sensor classes selected from the group consisting of;
radiant, electrochemical, electronic, mechanical, magnetic and/or thermal devices.- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A monitoring device, comprising:
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a. a power source; b. wireless communication equipment; and c. at least one sensor or sensing system utilizing microelectromechanical systems (MEMS) technology that consumes less than 500 μ
W of power;wherein data gathered from the at least one sensor or sensing system is transferred by the wireless communication equipment to a central communication hub; wherein the at least one sensor or sensing system comprises a microelectromechanical nano-sensor platform having; a substrate including an upper surface, wherein the upper surface comprises an insulator or has an insulator layer thereon; a microstructure conductive layer deposited in a pattern on the surface to make several devices, wherein the conductive layer comprises one or more filaments, and wherein the filaments are disposed above and parallel to the substrate configured such that there is an air gap between the filaments and the upper surface of the substrate; and
wherein filaments comprise a size/width less than 10 microns and a thickness of 1 micron or less.- View Dependent Claims (20)
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19. A monitoring device, comprising:
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a. a power source; b. wireless communication equipment; and c. at least one sensor or sensing system utilizing microelectromechanical systems (MEMS) technology that consumes less than 500 μ
W of power;wherein data gathered from the at least one sensor or sensing system is transferred by the wireless communication equipment to a central communication hub; wherein the at least one sensor or sensing system comprises a microelectromechanical nano-sensor platform having; a semiconductor substrate including a surface; a microstructure polysilicon layer deposited in a pattern on the surface to make several devices, wherein the polysilicon layer comprises a first pair of filaments, wherein the filaments are disposed above and parallel to the semiconductor substrate with an air gap between the base of the filaments and the surface of the substrate; an insulation layer, wherein the insulation layer is configured such that the first pair of filaments of the polysilicon layer remain exposed and are not covered by the insulation layer; one or more functionalization layers deposited on the exposed pair of filaments of the polysilicon layer, wherein the one or more functionalization layers are adapted to provide one or more transducer platform classes selected from the group consisting of;
radiant, electrochemical, electronic;
mechanical, and thermal; andwherein the at least one pair of the filaments has a width of less than 10 microns. - View Dependent Claims (21)
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Specification