Method and system for a leaky wave antenna as a load on a power amplifier

• US 8,320,856 B2
• Filed: 12/30/2009
• Issued: 11/27/2012
• Est. Priority Date: 06/09/2009
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Rofougaran, Ahmadreza, Rofougaran, Maryam
• Primary Examiner(s): PHU, SANH D
• Application Number:
  US12/650,212
• Publication Number:
  US 20100311368A1
• Time in Patent Office: 1,063 Days
• Field of Search: 455/129, 455/121, 455/232.1, 455/127.2, 455/127.3, 343/700.MS
• US Class Current: 455/129
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 13/22 Longitudinal slot in boundary wall of waveguide or transmission line H01Q13/203 takes precedence

Abstract

Methods and systems for utilizing a leaky wave antenna as a load on a power amplifier are disclosed and may include configuring one or more leaky wave antennas as a load for one or more power amplifiers (PAs) in a wireless device. RF signals may be transmitted via the leaky wave antennas which may be integrated on the chip, a package to which the chip is affixed, or on a printed circuit board to which the chip is affixed. The antennas may include an inductive load and/or a balun for the one or more PAs. The leaky wave antennas may be impedance matched to the PAs. The PAs may amplify a signal to be transmitted, and an output power of the PAs may be configured by controlling a bias voltage for the PAs.

Claims

1. A method for communication, the method comprising:

utilizing one or more circuits comprising one or more power amplifiers integrated on a chip in a wireless device;

configuring one or more leaky wave antennas which are coupled to said one or more power amplifiers, to operate as a load for said one or more power amplifiers;

configuring a variable input impedance of each of said one or more leaky wave antennas by adjusting a position of one or more feed points.

2. The method according to claim 1, comprising transmitting RF signals via said one or more leaky wave antennas.

3. The method according to claim 1, wherein said one or more leaky wave antennas are integrated on said chip.

4. The method according to claim 1, wherein said one or more leaky wave antennas are integrated on a package to which said chip is affixed.

5. The method according to claim 1, wherein said one or more leaky wave antennas are integrated on a printed circuit board to which said chip is affixed.

6. The method according to claim 1, wherein said one or more leaky wave antennas comprise an inductive load on said one or more power amplifiers.

7. The method according to claim 1, wherein said one or more leaky wave antennas comprise a balun for said one or more power amplifiers.

8. The method according to claim 1, wherein said one or more leaky wave antennas is impedance matched to said one or more power amplifiers.

9. The method according to claim 1, comprising amplifying a signal to be transmitted utilizing said one or more power amplifiers.

10. The method according to claim 1, comprising configuring an output power of said one or more power amplifiers by controlling a bias voltage for said one or more power amplifiers.

11. A system for enabling communication, the system comprising:

one or more circuits comprising one or more power amplifiers, said one or more circuits being integrated on a chip, wherein;

said one or more circuits are operable to configure one or more leaky wave antennas, which are coupled to said one or more power amplifiers, to operate as a load for said one or more power amplifiers;

each of said one or more leaky wave antennas is configured to provide a variable input impedance by adjusting a position of one or more feed points.

12. The system according to claim 11, wherein said one or more circuits are operable to transmit RF signals via said one or more leaky wave antennas.

13. The system according to claim 11, wherein said one or more leaky wave antennas are integrated on said chip.

14. The system according to claim 11, wherein said one or more leaky wave antennas are integrated on a package to which said chip is affixed.

15. The system according to claim 11, wherein said one or more leaky wave antennas are integrated on a printed circuit board to which said chip is affixed.

16. The system according to claim 11, wherein said one or more leaky wave antennas comprise an inductive load on said one or more power amplifier.

17. The system according to claim 11, wherein said one or more leaky wave antennas comprise a balun for said one or more power amplifiers.

18. The system according to claim 11, wherein said one or more leaky wave antennas is impedance matched to said one or more power amplifiers.

19. The system according to claim 11, wherein said one or more circuits are operable to amplify a signal to be transmitted utilizing said one or more power amplifiers.

20. The system according to claim 11, wherein said one or more circuits are operable to configure an output power of said one or more power amplifiers by controlling a bias voltage for said one or more power amplifiers.