Flexible distributed LED-based light source and method for making the same
First Claim
1. A precursor substrate comprising:
- a flexible printed circuit board having a bottom heat-conducting layer, an insulating layer, and a circuit layer, said insulating layer and said circuit layer comprising a plurality of openings that expose a top surface of said heat-conducting layer, and said circuit layer comprising a plurality of electrical conductors;
a plurality of dies bonded to said heat-conducting layer in a corresponding plurality of said openings, each die comprising an LED that is electrically connected to one of said electrical conductors; and
a separation ridge extending above said circuit layer and said dies,wherein said separation ridge is configured such that said precursor substrate can be rolled up in a predetermined direction to form a plurality of coils such that said separation ridge prevents said LEDs and any structures constructed above said LEDs, except said separation ridge, from contacting said bottom heat-conducting layer of said flexible printed circuit board on an adjacent layer in said coil.
3 Assignments
0 Petitions
Accused Products
Abstract
A precursor structure for fabricating light sources, the light sources fabricated therefrom, and the method of fabricating the precursor structure are disclosed. A precursor substrate includes a flexible printed circuit board on which dies are bonded and a separation ridge. The flexible printed circuit board has a bottom heat-conducting layer, an insulating layer, and a circuit layer. The insulating layer and the circuit layer include a plurality of openings that expose the top surface of the heat-conducting layer. The separation ridge extends above the circuit layer and the dies and is configured to prevent contact with the dies and any structures constructed above the dies when the precursor substrate is in contact with a surface positioned over the die and in contact with the separation ridge. The structure is well suited for roll-to-roll processing equipment.
19 Citations
18 Claims
-
1. A precursor substrate comprising:
-
a flexible printed circuit board having a bottom heat-conducting layer, an insulating layer, and a circuit layer, said insulating layer and said circuit layer comprising a plurality of openings that expose a top surface of said heat-conducting layer, and said circuit layer comprising a plurality of electrical conductors; a plurality of dies bonded to said heat-conducting layer in a corresponding plurality of said openings, each die comprising an LED that is electrically connected to one of said electrical conductors; and a separation ridge extending above said circuit layer and said dies, wherein said separation ridge is configured such that said precursor substrate can be rolled up in a predetermined direction to form a plurality of coils such that said separation ridge prevents said LEDs and any structures constructed above said LEDs, except said separation ridge, from contacting said bottom heat-conducting layer of said flexible printed circuit board on an adjacent layer in said coil. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 18)
-
-
11. A method for fabricating a light source, said method comprising:
-
providing a flexible printed circuit board having a bottom heat-conducting layer, an insulating layer, and a circuit layer, said insulating layer and said circuit layer comprising a plurality of openings that expose a top surface of said heat-conducting layer, and said circuit layer comprising a plurality of electrical conductors; bonding a plurality of dies to said heat-conducting layer in a corresponding plurality of said openings, each of said dies comprising an LED; connecting each of said dies to one of said electrical conductors; providing a separation ridge structure extending above said circuit layer and said dies; and rolling up said flexible printed circuit board in a first direction to form a plurality of coils such that said separation ridge prevents said LEDs and any structures constructed above said LEDs, except said separation ridge, from contacting said bottom heat-conducting layer of said flexible printed circuit board on an adjacent layer in said coil. - View Dependent Claims (12, 13, 14, 15, 16, 17)
-
Specification