Turbocharger protection device

• US 8,328,419 B2
• Filed: 01/30/2008
• Issued: 12/11/2012
• Est. Priority Date: 03/01/2007
• Status: Expired due to Fees

• Current Assignee: Heraeus Nexensos GmbH (Yageo Corporation)
• Original Assignee: Heraeus Sensor Technology GmbH (Heraeus Holding GMBH)
• Inventors: Wienand, Karlheinz, Bachmann, Mario, Muziol, Matthias, Loose, Thomas
• Primary Examiner(s): Smith, R. A.
• Application Number:
  US12/529,484
• Publication Number:
  US 20100091817A1
• Time in Patent Office: 1,777 Days
• Field of Search: 374/141, 374/159, 374/163, 374/185, 374/208
• US Class Current: 374/181
• CPC Class Codes: G01K 1/12 for preventing damage due to heat overloading
• CPC Class Codes: G01K 2205/02 for measuring inlet gas temperature
• CPC Class Codes: G01K 7/16 using resistive elements resistive elements per se H01C, H01L
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.

Abstract

A temperature sensor, particularly a high-temperature sensor, is provided in which an MI line or a heat-decoupling wire is arranged between the measurement resistor (chip) and the supply-line cable. Springs are stuck on the strands of the MI line, whereby the contacting to the measurement resistor is realized, or the heat-decoupling wire is stretched on one side to the end facing the measurement resistor and is connected elastically on the other end to the supply-line cable.

Claims

1. A high-temperature sensor element for a turbocharger-overheating protection device, the sensor element comprising a chip fired in a casting compound within a jacket tube and connected elastically with bonding wires to strands of a mineral-insulated supply line, which lead out of the casting compound, wherein the bonding wires are wound elastically around the strands.

2. A high-temperature sensor element for a turbocharger-overheating protection device, the sensor element comprising a chip fired in a casting compound within a jacket tube and connected elastically with bonding wires to heat-decoupling wires, which lead out of the casting compound, wherein the heat-decoupling wires are essentially surrounded by a ceramic capillary tube and are connected to spiral-shaped connection cables at their end opposite the chip.

3. A turbocharger overheating protection device, comprising a high-temperature sensor element for a temperature range of −

40°

C. to 1200°

C., the high-temperature sensor element comprising a chip (1) made of a platinum thin-film measurement resistor on an electrically insulating oxide substrate, which is embedded in a ceramic casting compound (2) and is connected electrically with spring-shaped bonding wires (3) to strands, which lead out of the casting compound (2), wherein the bonding wires are wound elastically around the strands.

4. A turbocharger overheating protection device, comprising a high-temperature sensor element for a temperature range of −

40°

C. to 1200°

C., the high-temperature sensor element comprising a chip (1) made of a platinum thin-film measurement resistor on an electrically insulating oxide substrate, which is embedded in a ceramic casting compound (2) and is connected electrically with spring-shaped bonding wires (3) to heat-decoupling wires (4), which lead out of the casting compound (2), wherein the heat-decoupling wires (4) are surrounded essentially by a ceramic capillary tube (5) and are connected to spiral-shaped connection cables (6) at their end opposite the chip.

5. A method for the production of a high-temperature sensor element for a turbocharger overheating protection device, the method comprising firing a chip in a casting compound within a jacket tube, and elastically connecting the chip with bonding wires to strands, which lead out of the casting compound, wherein the bonding wires are wound elastically around the strands.

6. A method for the production of a high-temperature sensor element for a turbocharger overheating protection device, the method comprising firing a chip in a casting compound within a jacket tube, and elastically connecting the chip with bonding wires to heat-decoupling wires, which lead out of the casting compound, wherein the heat-decoupling wires are essentially surrounded by a ceramic capillary tube and are connected to spiral-shaped connection cables at their end opposite the chip.