Leadframe strip and mold apparatus for an electronic component and method of encapsulating an electronic component

• US 8,334,583 B2
• Filed: 07/20/2005
• Issued: 12/18/2012
• Est. Priority Date: 07/20/2005
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Low, Jeffrey Khai Huat, Lee, Kean Cheong
• Primary Examiner(s): Vu, David
• Assistant Examiner(s): TAYLOR, EARL N
• Application Number:
  US11/994,505
• Publication Number:
  US 20080290484A1
• Time in Patent Office: 2,708 Days
• Field of Search: 257/670, 257/675, 257/784, 257/E23.044, 257/E23.051
• US Class Current: 257/670
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/49562 for devices being provided for in H01L29/00
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/207 Diameter ranges

Abstract

A leadframe strip comprises a plurality of units arranged in a line. Each unit provides two component positions, each having a chip support substrate. The chip support substrates of the two component positions are mechanically linked by at least one support bar. The two component positions of a unit are molded at essentially the same time to produce a plastic housing for a package in each component position. The central portion of the first support bars remains outside of the plastic housing of the two packages.

Claims

1. A leadframe strip comprising:

a plurality of units arranged in a line, each of the plurality of units providing two component positions, each component position comprising;

a chip support substrate;

a drain lead extending from the chip support substrate in a direction;

at least one source lead and at least one gate lead, whereby the source lead and the gate lead each extend in a direction parallel to the drain lead and each have an inner portion with an inner bonding area and an outer portion, whereby the end of the inner lead portions of the source lead and of the gate lead are spaced from the chip support substrate, and wherein the source lead, the gate lead and the drain lead are located on one side of the chip support substrate and are coupled by a tie bar;

the chip support substrates of the component positions of the unit being disposed adjacent to each other; and

at least one first support bar extending between the chip support substrates of the two component positions of each unit in a direction parallel to the drain lead; and

wherein each unit has an axis extending perpendicular to the line and parallel with the drain, source and gate leads, wherein the component positions are both situated on the axis.

2. The leadframe strip of claim 1, wherein the source lead, the gate lead, the drain lead and the first support bar each extend in a direction substantially perpendicular to the line.

3. The leadframe strip of claim 2, wherein the source lead, the gate lead and the drain lead extend towards the outer edge of the leadframe strip and the chip support substrate of each component position is located towards the centre of the leadframe strip.

4. The leadframe strip of claim 1, wherein two first support bars are provided, the first support bars being spaced apart and disposed at the periphery of opposing edges of the chip support substrate.

5. The leadframe strip of claim 1, wherein second support bars couple adjacent chip support substrates of adjacent units.

6. The leadframe strip of claim 1, wherein the chip support substrate comprises a chip mounting region and a heat sink region, the chip mounting region being adjacent the source lead and the gate lead, and wherein the drain lead extends from the chip mounting region.

7. The leadframe strip of claim 6, wherein the first support bar extends between the heat sink regions of the two chip support substrates of each unit.

8. The leadframe strip of claim 1, wherein the first support bar comprises at least one predetermined breaking point.

9. The leadframe strip of claim 8, wherein the predetermined breaking point comprises a narrowing in the cross-section of the first support bar.

10. The leadframe strip of claim 1, wherein each component position provides a leadframe for a TO220 component.