Apparatus and method for use in mounting electronic elements
DCFirst Claim
1. A surface mount device, comprising:
- a casing comprising a first surface;
a recess formed in said first surface and extending at least partially into said casing; and
a plurality of electrodes at least partially encased by said casing, wherein one of said electrodes comprises a first electrode with a chip carrier part at least partially exposed through said recess;
said first electrode dividing into a first plurality of leads as it extends away from said chip carrier part toward the perimeter of said casing, with said first plurality of leads joining into a single joined lead portion before said first electrode portion projects outside of said casing.
4 Assignments
Litigations
2 Petitions
Accused Products
Abstract
Some embodiments provide surface mount devices that include a first electrode comprising a chip carrier part, a second electrode disposed proximate to the chip carrier part, and a casing encasing a portion of the first and second electrodes. The first electrode can extend from the chip carrier part toward a perimeter of the casing, and the second electrode can extend away from the chip carrier part and projects outside of the casing. In extending away from the chip carrier part the first electrode divides into a plurality of leads separated by an aperture that join into a single first joined lead portion with a first width before projecting outside of the casing and maintains the first width outside of the casing. The second electrode can attain a second width prior to projecting outside of the casing and maintains the second width outside the casing.
129 Citations
38 Claims
-
1. A surface mount device, comprising:
-
a casing comprising a first surface; a recess formed in said first surface and extending at least partially into said casing; and a plurality of electrodes at least partially encased by said casing, wherein one of said electrodes comprises a first electrode with a chip carrier part at least partially exposed through said recess; said first electrode dividing into a first plurality of leads as it extends away from said chip carrier part toward the perimeter of said casing, with said first plurality of leads joining into a single joined lead portion before said first electrode portion projects outside of said casing. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
-
-
16. A surface mount device, comprising:
-
a casing comprising a first surface; a recess formed in said first surface and extending at least partially into said casing; and a plurality of electrodes at least partially encased by said casing, wherein one of said electrodes comprises a first electrode with a chip carrier part at least partially exposed through said recess; said first electrode dividing into a first plurality of leads as it extends away from said chip carrier part toward the perimeter of said casing, with said first plurality of leads joining into a single joined lead portion before said first electrode portion projects outside of said casing; wherein another of said plurality of electrodes comprises a second electrode proximate said first electrode and separated from said chip carrier part by an insulation gap; wherein said second electrode comprises a second plurality of leads separated by an inlet and is positioned relative to said casing such that a portion of each of said second plurality of leads and a first portion of said inlet are exposed through said recess. - View Dependent Claims (17)
-
-
18. A surface mount device, comprising:
-
a casing comprising a first surface; a recess formed in said first surface and extending at least partially into said casing; and a plurality of electrodes at least partially encased by said casing, wherein one of said electrodes comprises a first electrode with a chip carrier part at least partially exposed through said recess; said first electrode comprising a plurality of leads extending away from said chip carrier part, such that said chip carrier part widens as said chip carrier part extends toward and into said leads, with a first and second of said leads generally extending in a first direction away from said chip carrier part, and a third lead extending in a second direction away from said chip carrier part. - View Dependent Claims (19, 20, 21, 22, 23, 24)
-
-
25. A surface mount device, comprising:
-
a casing comprising a first surface; a recess formed in said first surface and extending at least partially into said casing; and a plurality of electrodes at least partially encased by said casing, wherein at least one of said electrodes divides into a plurality of leads extending away from said electrode such that said electrode widens as said electrode extends toward and into said leads; one or more of said electrodes and said leads comprising one or more gaps between them, with at least a portion of at least one of said gaps exposed through said recess. - View Dependent Claims (26, 27, 28)
-
-
29. A surface mount device, comprising:
-
a casing comprising a recess extending at least partially into said casing; and a plurality of electrodes at least partially encased by said casing, wherein at least one of said electrodes divides into a plurality of leads extending away from said electrode such that said electrode widens as said electrode extends toward and into said leads, wherein at least one of said electrodes comprises a portion exposed through said recess, at least one of said electrodes comprising one or more stabilizing features to secure the positioning of said electrodes relative to said casing. - View Dependent Claims (30, 31, 32, 33, 34, 35, 36, 37, 38)
-
Specification