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Light-based sealing and device packaging

  • US 8,379,392 B2
  • Filed: 10/23/2009
  • Issued: 02/19/2013
  • Est. Priority Date: 10/23/2009
  • Status: Expired due to Fees
First Claim
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1. An electronic device package, comprising:

  • a substrate comprising an electronic device;

    a backplate; and

    a light-treated thin film seal disposed between the substrate and the backplate to form a package comprising the electronic device, wherein the thin film seal includes a spacer layer, a reflective layer, and an absorber layer on the opposite side of the spacer layer as the reflective layer.

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