Light-based sealing and device packaging
First Claim
1. An electronic device package, comprising:
- a substrate comprising an electronic device;
a backplate; and
a light-treated thin film seal disposed between the substrate and the backplate to form a package comprising the electronic device, wherein the thin film seal includes a spacer layer, a reflective layer, and an absorber layer on the opposite side of the spacer layer as the reflective layer.
2 Assignments
0 Petitions
Accused Products
Abstract
Systems and methods for manufacturing and packaging electronic devices with light absorptive thin film stacks are provided. In one embodiment, a light is applied to a light absorptive thin film stack disposed between a substrate and a backplate to seal the substrate to the backplate. In another embodiment, the light absorptive thin film stack includes a plurality of thin film layers. In yet another embodiment, the light absorptive thin film stack includes a spacer layer over a reflective layer and an absorber layer over the spacer layer. In still another embodiment, the light absorptive thin film stack is less than 200 nanometers thick. In yet a further embodiment, a light absorptive thin film stack is used to seal a substrate having glass, plastic, metal, or silicon to a backplate having glass, plastic, metal, or silicon. Thus, the light absorptive thin film stack is used to seal similar or dissimilar materials through a bonding process.
282 Citations
23 Claims
-
1. An electronic device package, comprising:
-
a substrate comprising an electronic device; a backplate; and a light-treated thin film seal disposed between the substrate and the backplate to form a package comprising the electronic device, wherein the thin film seal includes a spacer layer, a reflective layer, and an absorber layer on the opposite side of the spacer layer as the reflective layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
-
-
17. An electronic device package, comprising:
-
means for supporting an electronic device; means for covering the electronic device to form a package; and a light-treated thin film seal between the covering means and the supporting means, the thin film seal including a plurality of layers that have been exposed to light to seal the supporting means to the covering means, the plurality of layers including at least a reflective layer, a spacer layer, and an absorber layer, wherein the spacer layer is over the reflective layer and the absorber layer is over the spacer layer. - View Dependent Claims (18, 19, 20, 21, 22, 23)
-
Specification