Field configured electronic circuits and methods of making the same
First Claim
1. A method of field programming an integrated circuit, comprising:
- a) inputting logic and/or circuit functions into a computer configured to design one or more circuit layouts;
b) designing the one or more circuit layouts from the logic and/or circuit functions; and
c) printing one or more metal layers on or over a transistor array on a substrate, according to the one or more circuit layouts.
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Accused Products
Abstract
Semiconductor devices and/or structures, and methods for fabricating the same are disclosed. Embodiments of the present invention allow for production of customized products, while also minimizing production steps, avoiding some or all photolithography steps, and reducing overall production costs. Using selective deposition and patterning methods such as printing, to form metal and/or dielectric layer(s) on substrates where one or more device circuit components are pre-made in a factory, but which require further processing to obtain an electrically functional circuit, results in the ability for a user/consumer to make custom, specific and/or unique electrically functional circuits without incurring the cost and complexity of a full fabrication to form and pattern all of the layers.
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Citations
20 Claims
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1. A method of field programming an integrated circuit, comprising:
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a) inputting logic and/or circuit functions into a computer configured to design one or more circuit layouts; b) designing the one or more circuit layouts from the logic and/or circuit functions; and c) printing one or more metal layers on or over a transistor array on a substrate, according to the one or more circuit layouts. - View Dependent Claims (2, 3, 4, 5)
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6. A method of field-configuring a circuit, comprising:
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a) depositing a first metal ink according to a predetermined wiring pattern on or over a substrate having (i) an array of transistors thereon and (ii) a first dielectric layer on the transistors, the first dielectric layer having a first plurality of contact openings therein, wherein the predetermined wiring pattern enables functionality and/or logic in a circuit comprising the transistors and the predetermined wiring pattern; and b) forming a first plurality of patterned metal lines from the first metal ink. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification