Semiconductor device comprising multilayer interconnect structure with overlapping vias
First Claim
1. A semiconductor device comprising a multilayer interconnect structure which is formed above a substrate and includes first to Nth interconnect layers, where N is an integer equal to or larger than 4, stacked from the substrate in this order, the semiconductor device comprising:
- a lower-layer interconnect formed in the first interconnect layer;
an intermediate interconnect formed in the second interconnect layer;
an upper-layer interconnect formed in the (N−
1)th interconnect layer;
a first contact via formed to electrically connect the lower-layer interconnect to the intermediate interconnect; and
a second contact via formed to electrically connect the intermediate interconnect to the upper-layer interconnect,wherein when viewed from above, the first contact via and the second contact via both have a rectangular shape with their long sides extending in a same first direction parallel to a longitudinal axis of the lower-layer interconnect, and overlap with each other, andwherein a dimension of the intermediate interconnect extending in the first direction is equal to or greater than a length of the long sides of each of the first contact via and the second contact via.
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Accused Products
Abstract
A semiconductor device having a multilayer interconnect structure allowing heat in an interconnect layer at an intermediate level to be effectively dissipated is provided. A lower-layer interconnect (13), an intermediate interconnect (23), an upper-layer interconnect (33), a first contact via (15) formed to electrically connect the lower-layer interconnect (13) to the intermediate interconnect (23), and a second contact via (25) formed to electrically connect the intermediate interconnect (23) to the upper-layer interconnect (33) are provided. When viewed from above, the first and second contact vias (15, 25) both have a rectangular shape with their long sides extending in the same direction, and overlap with each other.
5 Citations
8 Claims
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1. A semiconductor device comprising a multilayer interconnect structure which is formed above a substrate and includes first to Nth interconnect layers, where N is an integer equal to or larger than 4, stacked from the substrate in this order, the semiconductor device comprising:
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a lower-layer interconnect formed in the first interconnect layer; an intermediate interconnect formed in the second interconnect layer; an upper-layer interconnect formed in the (N−
1)th interconnect layer;a first contact via formed to electrically connect the lower-layer interconnect to the intermediate interconnect; and a second contact via formed to electrically connect the intermediate interconnect to the upper-layer interconnect, wherein when viewed from above, the first contact via and the second contact via both have a rectangular shape with their long sides extending in a same first direction parallel to a longitudinal axis of the lower-layer interconnect, and overlap with each other, and wherein a dimension of the intermediate interconnect extending in the first direction is equal to or greater than a length of the long sides of each of the first contact via and the second contact via. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification