Sealing of an implantable medical device
First Claim
1. A method of adhering a protective layer to a substrate region of an implantable medical device (IMD) to form a covered substrate region, comprising:
- depositing an intermediate layer on a portion of the substrate region such that the intermediate layer binds to the portion of the substrate region to create a modified substrate region comprising the covered substrate region and a boundary region;
depositing a protective layer onto at least the intermediate layer along the covered substrate region but not along the boundary region; and
adhering the protective layer to the intermediate layer along only the covered substrate region such that an increased adhesion exists between the protective layer and the covered substrate region relative to adhesion that would be present between the portion of the substrate region and the protective layer and such that the boundary region improves resistance to delamination at an edge of the covered substrate region.
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Accused Products
Abstract
A method of adhering a protective layer applied to a substrate region of an implantable medical device (IMD) to form a covered substrate region. The method includes obtaining the IMD, depositing an intermediate layer on a portion of the substrate region of the IMD such that the intermediate layer binds to the portion of the substrate region to create a modified substrate region, and depositing the protective layer after depositing the intermediate layer onto the intermediate layer and adhering the protective layer to the intermediate layer. In an embodiment of the present invention, this method enhances the sealing characteristics of the protective layer by, for example, reducing the likelihood of delamination of the protective layer from the IMD relative to IMDs prepared by certain other methods.
6 Citations
20 Claims
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1. A method of adhering a protective layer to a substrate region of an implantable medical device (IMD) to form a covered substrate region, comprising:
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depositing an intermediate layer on a portion of the substrate region such that the intermediate layer binds to the portion of the substrate region to create a modified substrate region comprising the covered substrate region and a boundary region; depositing a protective layer onto at least the intermediate layer along the covered substrate region but not along the boundary region; and adhering the protective layer to the intermediate layer along only the covered substrate region such that an increased adhesion exists between the protective layer and the covered substrate region relative to adhesion that would be present between the portion of the substrate region and the protective layer and such that the boundary region improves resistance to delamination at an edge of the covered substrate region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. An implantable medical device (IMD), comprising:
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a housing assembly containing electronics components, the housing assembly including a substrate region comprising a modified substrate region that includes a covered substrate region and a boundary region; an intermediate layer adhering to the substrate region along substantially the entire modified substrate region; and a protective layer adhering to at least the intermediate layer along the covered substrate region but not along the boundary region such that, at the boundary region, the protective layer is not adhered to the intermediate layer, wherein an increased adhesion exists between the protective layer and the intermediate layer relative to adhesion that would be present between the substrate region and the protective layer and wherein the boundary region improves resistance to delamination at an edge of the housing assembly. - View Dependent Claims (16, 17, 18, 19)
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20. An implantable medical device (IMD), comprising:
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a housing assembly containing electronics components, the housing assembly including a substrate region comprising a modified substrate region that includes a covered substrate region and a boundary region; an intermediate layer adhering to the substrate region along the modified substrate region; and a protective layer adhering to at least the intermediate layer such that the protective layer adheres to the intermediate layer along the covered substrate region but does not adhere to the intermediate layer along the boundary region, wherein a bond between the intermediate layer and the protective layer is a Ti—
O—
Si bond, and wherein the Ti—
O—
Si bond is more stable than a PT—
O—
Si bondand wherein the boundary region improves resistance to delamination at an edge of the housing assembly.
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Specification