Wireless IC device and electronic apparatus

• US 8,413,907 B2
• Filed: 05/10/2012
• Issued: 04/09/2013
• Est. Priority Date: 07/17/2007
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Ikemoto, Nobuo, Ishino, Satoshi, Dokai, Yuya, Kato, Noboru, Kataya, Takeshi, Kimura, Ikuhei, Tanaka, Mikiko
• Primary Examiner(s): LEE, SEUNG H
• Application Number:
  US13/468,058
• Publication Number:
  US 20120217312A1
• Time in Patent Office: 334 Days
• Field of Search: 235/380, 235/451, 235/492
• US Class Current: 235/492
• CPC Class Codes: H01L 2224/13139 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/1531 the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19042 being an inductor
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/40 Radiating elements coated with or embedded in protective material
• CPC Class Codes: H01Q 9/28 Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines waveguide horns or mouths H01Q13/00; slot antennas H01Q13/00
• CPC Class Codes: H03H 2007/386 Multiple band impedance matching
• CPC Class Codes: H03H 7/38 Impedance-matching networks
• CPC Class Codes: H05K 1/0237 High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/0239 Signal transmission by AC coupling
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/10098 : Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas

Abstract

A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.

Claims

1. An electronic component comprising:

a printed wiring board including a recess provided in a side surface of the printed wiring board; and

a wireless IC device including a wireless IC arranged to transmit and receive signals and a feeder circuit substrate including a feeder circuit incorporating an inductance element connected to the wireless IC;

wherein

the wireless IC device is accommodated in the recess of the printed wiring board.

2. The electronic component according to claim 1, further comprising a resonant circuit that is provided in the feeder circuit substrate.

3. The electronic component according to claim 1, further comprising a matching circuit that is provided in the feeder circuit substrate.

4. The electronic component according to claim 1, further comprising a radiation plate that is provided on a surface and/or inside the printed wiring board.

5. The electronic component according to claim 4, wherein the feeder circuit substrate is electromagnetically coupled to the radiation plate in an electrically non-conductive state.

6. The electronic component according to claim 4, wherein the wireless IC device includes a feeder electrode disposed on a surface of the feeder circuit substrate and electromagnetically coupled to the radiation plate in an electrically non-conductive state.

7. The electronic component according to claim 1, wherein the wireless IC device includes a feeder electrode coupled to the inductance element and disposed on a surface of the feeder circuit substrate or an inside of the feeder circuit substrate.

8. The electronic component according to claim 1, wherein the feeder circuit substrate includes a laminated body in which an insulating material layer and an electrode layer are laminated.

9. The electronic component according to claim 1, wherein the wireless IC device includes a protection film arranged on a surface of the feeder circuit substrate so as to cover a portion connected with the wireless IC chip.