Light emitting device

• US 8,421,094 B2
• Filed: 01/21/2011
• Issued: 04/16/2013
• Est. Priority Date: 01/22/2010
• Status: Active Grant

• Current Assignee: Heavy Duty Lighting LLC (Ni, Wang & Massand, PLLC)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Hata, Toshio, Ishizaki, Shinya, Agatani, Makoto, Nada, Tomokazu
• Primary Examiner(s): TRAN, MINH LOAN
• Application Number:
  US13/011,124
• Publication Number:
  US 20110180817A1
• Time in Patent Office: 816 Days
• Field of Search: 257/88, 257/89, 257/98, 257/99, 257/E33.061, 257/E33.057
• US Class Current: 257/88
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21K 9/238 Arrangement or mounting of circuit elements integrated in the light source
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 3/00 Globes; Bowls; Cover glasses with refracting properties F21V5/00; with reflecting properties F21V7/00; characterised by cooling arrangements F21V29/506
• CPC Class Codes: F21V 5/048 the lens being a simple lens adapted to cooperate with a point-like source for emitting mainly in one direction and having an axis coincident with the main light transmission direction, e.g. convergent or divergent lenses, plano-concave or plano-convex lenses
• CPC Class Codes: F21V 5/10 comprising photoluminescent material
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 27/15 including semiconductor components having potential barriers, specially adapted for light emission
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/54 : having a particular shape
• CPC Class Codes: H01L 33/56 : Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 : Reflective elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting device includes: a ceramic substrate; a plurality of LED chips; a printed resistor(s) connected in parallel with the plurality of LED chips; a dam resin made of a resin having a low optical transmittance; a fluorescent-material-containing resin layer; and an anode-side electrode and a cathode-side electrode, (a) which are provided on a primary surface of the ceramic substrate so as to face each other along a first direction on the primary surface and (b) which are disposed below at least one of the dam resin and the fluorescent-material-containing resin layer. With the configuration in which a plurality of LEDs, which are connected in a series-parallel connection, are provided on a substrate, it is possible to provide a light emitting device which can achieve restraining of luminance unevenness and an improvement in luminous efficiency.

Claims

1. A light emitting device comprising:

a substrate;

a plurality of light emitting elements provided on a primary surface of the substrate;

at least one protective element connected in parallel with the plurality of light emitting element;

a resin frame made of a resin having a low optical transmittance, the resin frame being provided annularly on the primary surface of the substrate so as to surround a mounting area in which the plurality of light emitting elements are provided;

a fluorescent-material-containing resin layer made of a resin containing fluorescent materials, the fluorescent-material-containing resin layer being provided adjacent to an inner side of the resin frame so as to cover the plurality of light emitting elements; and

at least one first light emitting element connection electrode and at least one second light emitting element connection electrode, which are provided on the primary surface of the substrate so as to face each other along a first direction in the primary surface,

the plurality of light emitting elements having such a circuit configuration that at least two series circuit sections, in each of which at least two of the plurality of light emitting elements are connected in series, are connected in parallel between the at least one first light emitting element connection electrode and the at least one second light emitting element connection electrode,

the at least two series circuit sections being aligned along a second direction orthogonal to the first direction in the primary surface, between the at least one first light emitting element connection electrode and, the at least one second light emitting element connection electrode,

the at least two of the plurality of light emitting elements in each of the at least two series circuit sections being aligned along the first direction,

the at least one first light emitting element connection electrode and the at least one second light emitting element connection electrode being disposed below at least one of the resin frame and the fluorescent-material-containing resin layer.

2. The light emitting device as set forth in claim 1, wherein:

the plurality of light emitting elements are divided into a plurality of groups so that each of the plurality of groups includes a corresponding first light emitting element connection electrode and a corresponding second light emitting element connection electrode,

the plurality of groups are aligned along the second direction,

connection wiring lines are provided on the primary surface of the substrate so as to connect adjoining groups in series, and

each of the at least one protective element is provided for each of the plurality of groups.

3. The light emitting device as set forth in claim 2, wherein the resin used for forming the resin frame is colored in white or milky white.

4. The light emitting device as set forth in claim 2, wherein:

adjoining light emitting elements in each of the at least two series circuit sections are wire-bonded to each other such that a cathode electrode of one of the adjoining light emitting elements is directly connected, via a metal wire, to an anode electrode of the other one of the adjoining light emitting elements.

5. The light emitting device as set forth in claim 4, wherein:

each of the plurality of light emitting elements includes a cathode electrode and an anode electrode, which are provided so as to face each other, and

the plurality of light emitting elements are aligned in a same orientation in which the cathode electrode and the anode electrode of said each of the plurality of light emitting elements face each other along the first direction.

6. The light emitting device as set forth in claim 4, wherein:

each of the plurality of light emitting elements includes a cathode electrode and an anode electrode, which are provided so as to face each other, and

the plurality of light emitting elements are aligned in a same orientation in which the cathode electrode and the anode electrode of said each of the plurality of light emitting elements face each other along the second direction.

7. The light emitting device as set forth in claim 2, wherein:

the at least one protective element is at least one thin-film printed resistor each provided partially on the primary surface of the substrate, and

each of the at least one protective element is provided on a periphery of the mounting area and below at least one of the resin frame and the fluorescent-material-containing resin layer so as to be electrically connected to a corresponding first light emitting element connection electrode and a corresponding second light emitting element connection electrode in a corresponding group.

8. The light emitting device as set forth in claim 7, wherein:

the at least one thin-film printed resistor has a resistance value of 1 MΩ

to 10 GΩ

.

9. The light emitting device as set forth in claim 2, wherein the substrate is a ceramic substrate made of ceramic.

10. The light emitting device as set forth in claim 2, wherein the resin frame has an annular shape when viewed in a plane manner.

11. The light emitting device as set forth in claim 1, wherein:

the resin used for forming the resin frame is colored in white or milky white.

12. The light emitting device as set forth in claim 1, wherein:

adjoining light emitting elements in each of the at least two series circuit sections are wire-bonded to each other such that a cathode electrode of one of the adjoining light emitting elements is directly connected, via a metal wire, to an anode electrode of the other one of the adjoining light emitting elements.

13. The light emitting device as set forth in claim 12, wherein:

each of the plurality of light emitting elements includes a cathode electrode and an anode electrode, which are provided so as to face each other, and

the plurality of light emitting elements are aligned in a same orientation in which the cathode electrode and the anode electrode of said each of the plurality of light emitting elements face each other along the first direction.

14. The light emitting device as set forth in claim 12, wherein:

each of the plurality of light emitting elements includes a cathode electrode and an anode electrode, which are provided so as to face each other, and

the plurality of light emitting elements are aligned in a same orientation in which the cathode electrode and the anode electrode of said each of the plurality of light emitting elements face each other along the second direction.

15. The light emitting device as set forth in claim 1, wherein:

the at least one protective element is a thin-film printed resistor provided partially on the primary surface of the substrate, and

the at least one protective element is provided on a periphery of the mounting area and below at least one of the resin frame and the fluorescent-material-containing resin layer so as to be electrically connected to the at least one first light emitting element connection electrode and the at least one second light emitting element connection electrode.

16. The light emitting device as set forth in claim 15, wherein:

the thin-film printed resistor has a resistance value of 1 MΩ

to 10 GΩ

.

17. The light emitting device as set forth in claim 1, wherein the substrate is a ceramic substrate made of ceramic.

18. The light emitting device as set forth in claim wherein the resin frame has an annular shape when viewed in a plane manner.