Method and apparatus for an environmentally-protected electronic equipment enclosure

DC
  • US 8,424,885 B2
  • Filed: 11/17/2009
  • Issued: 04/23/2013
  • Est. Priority Date: 12/22/2005
  • Status: Expired due to Fees
First Claim
Patent Images

1. An electronic component enclosure, comprising:

  • a platform;

    an inner frame coupled to the platform;

    an enclosure surrounding the inner frame;

    a first set of electronic components mounted within the inner frame;

    an environment control unit coupled to the enclosure, the environment control unit generating cooled airflow without introducing external air into the enclosure;

    a plenum formed below the inner frame, the plenum forming a duct to direct the cooled airflow to the first set of electronic components; and

    a ducted channel coupled to the environment control unit and the plenum to direct the cooled airflow from the environment control unit to the plenum.

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