Method and apparatus for an environmentally-protected electronic equipment enclosure

  • US 8,424,885 B2
  • Filed: 11/17/2009
  • Issued: 04/23/2013
  • Est. Priority Date: 12/22/2005
  • Status: Expired due to Fees
First Claim
Patent Images

1. An electronic component enclosure, comprising:

  • a platform;

    an inner frame coupled to the platform;

    an enclosure surrounding the inner frame;

    a first set of electronic components mounted within the inner frame;

    an environment control unit coupled to the enclosure, the environment control unit generating cooled airflow without introducing external air into the enclosure;

    a plenum formed below the inner frame, the plenum forming a duct to direct the cooled airflow to the first set of electronic components; and

    a ducted channel coupled to the environment control unit and the plenum to direct the cooled airflow from the environment control unit to the plenum.

View all claims

    Thank you for your feedback