Thermal management of LED-based lighting systems

• US 8,425,085 B2
• Filed: 04/28/2009
• Issued: 04/23/2013
• Est. Priority Date: 04/16/2006
• Status: Active Grant

• Current Assignee: Current Lighting Solutions, LLC (f/k/a GE Lighting Solutions, LLC) (American Industrial Partners)
• Original Assignee: Albeo Technologies (Savant Systems, LLC)
• Inventors: Van Laanen, Peter, Bisberg, Jeffrey, Cannon, Neil, Earles, Tracy
• Primary Examiner(s): Dzierzynski, Evan
• Assistant Examiner(s): ALLEN, DANIELLE NICOLE
• Application Number:
  US12/431,674
• Publication Number:
  US 20090290348A1
• Time in Patent Office: 1,456 Days
• Field of Search: 362/800, 362/547, 362/218, 362/264, 362/294, 362/345, 362/373, 362/227, 362/235, 362/237, 362/241, 362/243, 362/246, 362/247, 362/248, 362/249.02, 362/249.11, 362/296.01, 362/300, 362/311.02
• US Class Current: 362/294
• CPC Class Codes: F21V 21/00 Supporting, suspending, or attaching arrangements for lighting devices F21V17/00, F21V19/00 take precedence; arrangement of signalling or lighting devices, the mounting or supporting thereof or circuits therefor, for vehicles in general B60Q, stands for supporting apparatus or articles in general F16M11/00; Hand grips
• CPC Class Codes: F21V 29/506 of globes, bowls or cover glasses
• CPC Class Codes: F21V 29/507 of means for protecting lighting devices from damage, e.g. housings
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: F21V 3/02 characterised by the shape
• CPC Class Codes: F21V 3/04 characterised by materials, surface treatments or coatings
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/0969 Apertured conductors
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2203/1572 Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: Y02B 20/30 Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Abstract

An LED-based lighting system includes a housing forming one or more apertures, a PCB having conductors on its front-side, and one or more LEDs mounted with the conductors. The PCB mounts with the conductors proximate to a top surface of the housing such that the LEDs emit light through the apertures, and heat generated by the one or more LEDs primarily dissipates through the conductors to the housing. A retrofit apparatus for a light fixture includes a PCB having conductors on its front-side thereof, and one or more LEDs mounted with the conductors. The PCB mounts with the conductors proximate to a surface of a mounting bracket that is configured for mounting to the light fixture, such that when the bracket mounts to the light fixture, heat generated by the one or more LEDs primarily dissipates through the conductors and the structural element to the light fixture.

Claims

1. A light-emitting diode (“

LED”

) based retrofit apparatus for a light fixture, comprising;

a bracket configured for attachment to the light fixture;

electronics mounted with the bracket, for converting AC line voltage power to low voltage DC power;

a first printed circuit board having one or more LEDs mounted thereon, the first printed circuit board mounting with the bracket such that when the first printed circuit board is supplied with the low voltage DC power, the LEDs mounted on the first printed circuit board primarily emit light upwardly into the light fixture, and the light reflects from one or more surfaces and exits the light fixture downwardly;

a second printed circuit board having one or more LEDs mounted thereon, the second printed circuit board mounting with the bracket such that, when supplied with the low voltage DC power, the LEDs mounted on the second printed circuit board primarily emit light downwardly with respect to the light emitted from the LEDs mounted on the first printed circuit board; and

a diffuser disposed beneath the second printed circuit board, such that light emitted from the LEDs mounted on the second printed circuit board passes through the diffuser, but the light reflecting from the one or more surfaces does not pass through the diffuser.

2. The LED based retrofit apparatus of claim 1, wherein the one or more surfaces are surfaces of the light fixture.

3. The LED based retrofit apparatus of claim 1, wherein the one or more surfaces are surfaces of the bracket.

4. The LED based retrofit apparatus of claim 1, the one or more surfaces being downwardly concave in shape.

5. The LED based retrofit apparatus of claim 1, the diffuser being a first diffuser, the apparatus further comprising a second diffuser through which the light from both the LEDs mounted on the first printed circuit board, and the LEDs mounted on the second printed circuit board, passes to exit the light fixture.

6. The LED based retrofit apparatus of claim 1, wherein the printed circuit board and bracket form a primary heat dissipation path for the LEDs.

7. A light-emitting diode (“

LED”

) based lighting system, comprising;

a housing forming one or more apertures;

a printed circuit board (“

PCB”

) having conductors on a front-side thereof; and

one or more LEDs mounted with the conductors;

the PCB being mounted with the conductors proximate to and thermally coupling with a surface of the housing such that the LEDs emit light through the apertures, and heat generated by the one or more LEDs primarily dissipates through the conductors to the housing.

8. The lighting system of claim 7, wherein the conductors occupy at least 50% of a front-side area of the PCB.

9. The lighting system of claim 8, wherein the conductors occupy at least 70% of the front-side area.

10. The lighting system of claim 7, wherein the housing forms a troffer.

11. The lighting system of claim 10, the PCB being mounted with the conductors proximate to and thermally coupling with an outer surface of the housing, and wherein the housing does not enclose the PCB.

12. The lighting system of claim 7, wherein the housing forms one or more vent apertures.

13. The lighting system of claim 12, further comprising a diffuser that forms one or more vent apertures.

14. A light-emitting diode (“

LED”

) based lighting system, comprising;

a housing having one or more apertures formed therein;

one or more LEDs mounted in the one or more apertures to emit light through a front surface of the housing;

a printed circuit board (“

PCB”

) for controlling the LEDs, the PCB mounted on a back surface of the housing, the PCB including one or more electrical conductors that supply power to the one or more LEDs;

wherein the one or more electrical conductors thermally couple directly with the housing such that more heat generated by the LEDs dissipates through the one or more electrical conductors into the housing as compared to dissipation through other thermal paths.

15. The lighting system of claim 14, wherein the electrical conductors occupy at least 50% of a front-side area of the printed circuit board.

16. The lighting system of claim 15, wherein the conductors occupy at least 70% of the front-side area.

17. The lighting system of claim 14,

the housing being substantially two sided, the light being emitted so as to radiate away from the front surface, the back surface being an outer surface that faces away from the front surface;

the one or more apertures being formed through the housing; and

the one or more LEDs being mounted on the PCB such that when the PCB is mounted on the back surface of the housing, the one or more LEDs are mounted in the one or more apertures.