Light emitting diode systems including optical display systems having a microdisplay

• US 8,426,872 B2
• Filed: 06/08/2011
• Issued: 04/23/2013
• Est. Priority Date: 08/20/2004
• Status: Expired due to Fees

• Current Assignee: Luminus Devices Incorporated (Sanan Optoelectronics Company Limited)
• Original Assignee: Luminus Devices Incorporated (Sanan Optoelectronics Company Limited)
• Inventors: Erchak, Alexei A., Lidorikis, Elefterios
• Primary Examiner(s): ARMAND, MARC ANTHONY
• Application Number:
  US13/155,795
• Publication Number:
  US 20110303926A1
• Time in Patent Office: 685 Days
• Field of Search: 257/13, 257/79, 257/80, 257/82, 257/89, 257/93, 257/777, 257/778
• US Class Current: 257/79
• CPC Class Codes: G09G 2320/064 by time modulation of the brightness of the illumination source
• CPC Class Codes: G09G 3/3406 Control of illumination source illumination devices structurally associated with liquid crystal cells G02F1/1336
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2933/0083 Periodic patterns for optical field-shaping in or on the semiconductor body or semiconductor body package, e.g. photonic bandgap structures
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/36 characterised by the electrodes

Abstract

Light emitting diode systems are disclosed.

Claims

1. A system comprising:

a light emitting device including;

a multi-layer stack of materials including a light generating region, and a first layer supported by the light generating region, a surface of the first layer being configured so that light generated by the light generating region can emerge from the light emitting device via a surface of the first layer, a shape of a surface of the multi-layer stack being rectangular and the surface of the first layer having a dielectric function that varies spatially according to a pattern; and

at least one electrical contact pad disposed along an edge of the surface of the first layer; and

a package having a first surface and a second surface opposite the first surface, the package including;

a plurality of plated regions for providing electrical contact to the light emitting device; and

a plurality of wire bonds connected between the plated regions and the at least one electrical contact pad.

2. The system of claim 1, wherein the plurality of wire bonds includes at least about 5 wire bonds.

3. The system of claim 1, wherein the plurality of wire bonds includes at least about 10 wire bonds.

4. The system of claim 1, wherein the plurality of wire bonds includes at least about 25 wire bonds.

5. The system of claim 1, wherein the plurality of wire bonds includes at least about 50 wire bonds.

6. The system of claim 1, wherein an aspect ratio of the surface of the multi-layer stack is about 4×

3.

7. The system of claim 1, wherein the aspect ratio of the surface of the multi-layer stack is about 16×

9.

8. The system of claim 1, wherein the package further comprises a light emitting panel.

9. The system of claim 1, wherein the package is mounted on a heat sink device.

10. The system of claim 1, wherein the package is mounted on a core board.

11. The device of claim 1, wherein the light emitting device is a light emitting diode.

12. The device of claim 1, wherein the light emitting device is a surface emitting laser.

13. The system of claim 11, wherein an aspect ratio of the surface of the first layer is about 4×

3.

14. The system of claim 11, wherein an aspect ratio of the surface of the first layer is about 16×

9.

15. The device of claim 1, wherein the package further comprises a plurality of castellations to provide electrical contact from the first surface of the package to the second surface of the package.

16. The device of claim 11, wherein the light emitting diode is a photonic lattice light emitting diode.

17. The system of claim 16, wherein an aspect ratio of the surface of the first layer is about 4×

3.

18. The system of claim 16, wherein an aspect ratio of the surface of the first layer is about 16×

9.