Two-dimensional layout for use in a complex structure

• US 8,434,208 B2
• Filed: 07/12/2011
• Issued: 05/07/2013
• Est. Priority Date: 05/07/2007
• Status: Expired due to Fees

• Current Assignee: SARCOS LC (Sarcos Technology & Robotics Corp.)
• Original Assignee: Raytheon Company (Rtx Corporation)
• Inventors: Jacobsen, Stephen C., Marceau, David P.
• Primary Examiner(s): Hindenburg, Max
• Assistant Examiner(s): Pani, John
• Application Number:
  US13/181,380
• Publication Number:
  US 20110268914A1
• Time in Patent Office: 665 Days
• Field of Search: 600/585, 264/241, 295/92, 29428-431
• US Class Current: 29/428
• CPC Class Codes: A61M 2025/09108 Methods for making a guide wire
• CPC Class Codes: A61M 25/09 Guide wires
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49826 Assembling or joining
• CPC Class Codes: Y10T 428/24033 including stitching and discrete fastener[s], coating or bond

Abstract

A method for manufacturing a complex structure from a two-dimensional layout, the method comprising: (a) obtaining a support plate having a pre-determined, patterned recess formed in a surface thereof; (b) depositing a first series of individual flexible interconnects into the recess, the flexible interconnects being aligned parallel to one another in a common plane and supported by the support plate; (c) adhering, with adhering means, at least one rigid member to each of the flexible interconnects of the first series; (d) adhering, with adhering means, a second series of individual flexible interconnects to the rigid members to form a plurality of stations, wherein each of the second series of flexible interconnects is adhered to two rigid members of adjacent flexible interconnects of the first series, the flexible interconnects of the second series being formed perpendicular to the flexible interconnects of the first series; (e) curing the adhering means to form an assembled, layered structure; (f) removing the layered structure from the support plate; and (g) folding, systematically, the layered structure on itself and causing at least some of the stations to be supported about a central spine in a segmented manner.

Claims

1. A two-dimensional layout for use in forming an elongate structure, said two-dimensional layout comprising:

a support plate having a pre-determined, patterned recess formed in a surface thereof;

a first series of individual flexible interconnects disposed in the patterned recess of the support plate, said first series of flexible interconnects having a pre-determined configuration based on the patterned recess;

at least one rigid member adhered to each of said first series of flexible interconnects; and

a second series of individual flexible interconnects disposed in the patterned recess of the support plate and adhered to said rigid members, wherein an arrangement of a plurality of stations are formed, and wherein each of said second series of flexible interconnects is adhered to two rigid members of adjacent flexible interconnects of said first series.

2. The two-dimensional layout of claim 1, wherein said rigid member is adhered to said first and second series of individual flexible interconnects with a cured adhesive.

3. The two-dimensional layout of claim 1, further comprising an on-board system supported on at least one of said rigid members, wherein said on-board system and said station in support of said on-board system function as a performance station.

4. The two-dimensional layout of claim 3, wherein said performance station is selected from the group consisting of an intelligent performance station, an electrical performance station, a mechanical performance station, an actuation performance station, an information gathering performance station, a valving performance station, a pumping performance station, and an electro-mechanical performance station.

5. The two-dimensional layout of claim 3, wherein at least one of said first and second series of flexible interconnects comprises an electrical component that is electrically connected with said on-board system.

6. The two-dimensional layout of claim 1, further comprising a node disposed between adjacent stations.

7. The two-dimensional layout of claim 1, wherein said first and second series of flexible interconnects comprises a material selected from the group consisting of plastic, polymer, shape memory alloy and metalized polyimide film.

8. The two-dimensional layout of claim 1, wherein said first and second series of flexible interconnects and said at least one rigid member each comprise an aperture formed therein.

9. The two-dimensional layout of claim 1, wherein said second series of flexible interconnects are aligned parallel to one another and perpendicular to said first series of flexible interconnects.

10. The two-dimensional layout of claim 1, wherein said at least one rigid member is comprised of metal.

11. The two-dimensional layout of claim 1, wherein said rigid member is comprised of silicone, said rigid member functioning as a computer chip to facilitate one or more intelligent functions.