Optimization of desiccant usage in a MEMS package
First Claim
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1. A method of encapsulating a MEMS device, the method comprising:
- providing a substrate supporting a MEMS device;
providing a backplate;
providing a desiccant, said desiccant comprising calcium oxide and polytetrafluoroethylene;
baking said desiccant under conditions sufficient to cause outgassing of organics retained therein, wherein baking said desiccant under conditions sufficient to cause outgassing of organics retained therein comprises heating said desiccant beyond what is necessary to cure said desiccant; and
sealing said backplate to said substrate to form a MEMS package encapsulating the MEMS device and the desiccant.
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Abstract
A MEMS device may be package with a desiccant to provide a moisture-free environment. In order to avoid undesirable effects on the MEMS device, the desiccant may be selected or treated so as to be compatible with a particular MEMS device. This treatment may include baking of the desiccant to as to cause outgassing of moisture or other undesirable material. The structure of the MEMS device may also be altered to improve compatibility with particular desiccants.
78 Citations
16 Claims
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1. A method of encapsulating a MEMS device, the method comprising:
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providing a substrate supporting a MEMS device; providing a backplate; providing a desiccant, said desiccant comprising calcium oxide and polytetrafluoroethylene; baking said desiccant under conditions sufficient to cause outgassing of organics retained therein, wherein baking said desiccant under conditions sufficient to cause outgassing of organics retained therein comprises heating said desiccant beyond what is necessary to cure said desiccant; and sealing said backplate to said substrate to form a MEMS package encapsulating the MEMS device and the desiccant. - View Dependent Claims (2, 3, 9, 10, 11, 12)
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4. A method of encapsulating a MEMS device, the method comprising:
- providing a substrate supporting a MEMS device;
providing a backplate; providing a desiccant, said desiccant comprising calcium oxide and a polymer binding; baking said desiccant under conditions sufficient to cause outgassing of solvents retained therein, wherein baking said desiccant under conditions sufficient to cause outgassing of solvents retained therein comprises heating said desiccant beyond what is necessary to cure said desiccant; and sealing said backplate to said substrate to form a MEMS package encapsulating the MEMS device and the desiccant. - View Dependent Claims (5, 6, 7, 8, 13, 14, 15, 16)
- providing a substrate supporting a MEMS device;
Specification