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Amorphous multi-component metallic thin films for electronic devices

  • US 8,436,337 B2
  • Filed: 05/10/2010
  • Issued: 05/07/2013
  • Est. Priority Date: 05/12/2009
  • Status: Active Grant
First Claim
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1. An electronic device structure comprising:

  • (a) a first metal layer;

    (b) a second metal layer; and

    (c) at least one insulator layer located between the first metal layer and the second metal layer,wherein at least one of the metal layers comprises an amorphous multi-component metallic film and wherein the amorphous multi-component metallic film is selected from ZrCuAlNi or TiAl.

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