Low pin count wireless power IC
First Claim
1. A low pin count integrated circuit (IC) comprises:
- a wireless power receive coil operable to generate an AC voltage from a wireless power electromagnetic signal;
a rectifying circuit operable to generate a rectified voltage from the AC voltage;
an output circuit having an output circuit return node, wherein the output circuit is operable to generate a DC voltage from the rectified voltage;
a plurality of circuit modules, wherein each of the plurality of circuit modules includes a circuit return node;
a power management unit (PMU) having a PMU return node, wherein the PMU is operable to manage distribution of the DC voltage to the plurality of circuit modules,a die that supports the plurality of circuit modules and the PMU, wherein the die includes return pads for coupling to the plurality of circuit return nodes and the PMU return node; and
a package substrate that supports the die and includes return pins for coupling the return pads to a ground plane disposed external to the IC to reduce pin count for the IC, and wherein at least one of the die and the package substrate support the wireless power receive coil, the rectifying circuit, and the output circuit, in which wireless delivery of power is to be achieved without use of a supply voltage pin to reduce pin count for the IC.
5 Assignments
0 Petitions
Accused Products
Abstract
A low pin count IC includes a wireless power receive coil, a rectifying circuit, an output circuit, circuit modules, a power management unit (PMU), a die, and a package substrate. The wireless power receive coil generates an AC voltage from a wireless power electromagnetic signal and the rectifying circuit generates a rectified voltage from the AC voltage. The output circuit generates a DC voltage from the rectified voltage. The PMU manages distribution of the DC voltage to the circuit modules. The die supports the circuit modules and the PMU, wherein the die includes return pads for coupling to circuit return nodes and a PMU return node. The package substrate supports the die and includes return pins for coupling to the return pads, wherein at least one of the die and the package substrate support the wireless power receive coil, the rectifying circuit, and the output circuit.
28 Citations
20 Claims
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1. A low pin count integrated circuit (IC) comprises:
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a wireless power receive coil operable to generate an AC voltage from a wireless power electromagnetic signal; a rectifying circuit operable to generate a rectified voltage from the AC voltage; an output circuit having an output circuit return node, wherein the output circuit is operable to generate a DC voltage from the rectified voltage; a plurality of circuit modules, wherein each of the plurality of circuit modules includes a circuit return node; a power management unit (PMU) having a PMU return node, wherein the PMU is operable to manage distribution of the DC voltage to the plurality of circuit modules, a die that supports the plurality of circuit modules and the PMU, wherein the die includes return pads for coupling to the plurality of circuit return nodes and the PMU return node; and a package substrate that supports the die and includes return pins for coupling the return pads to a ground plane disposed external to the IC to reduce pin count for the IC, and wherein at least one of the die and the package substrate support the wireless power receive coil, the rectifying circuit, and the output circuit, in which wireless delivery of power is to be achieved without use of a supply voltage pin to reduce pin count for the IC. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A low pin count integrated circuit (IC) comprises:
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a wireless power receive coil operable to generate an AC voltage from a wireless power electromagnetic signal; a rectifying circuit operable to generate a rectified voltage from the AC voltage; a capacitance circuit operable to generate a DC voltage from the rectified voltage; a regulation module operable to; sense a voltage level of the DC voltage; compare the voltage level to a reference voltage to produce a comparison signal; and output the comparison signal such that a transmit wireless power unit adjusts the wireless power electromagnetic signal based on the comparison signal to regulate the DC voltage to a desired voltage level; a die; and a package substrate that supports the die, wherein at least one of the die and the package substrate support the wireless power receive coil, the rectifying circuit, and the capacitance circuit, in which wireless delivery of power is to be achieved without use of a supply voltage pin to reduce pin count for the IC, and the package substrate includes return pins for coupling the return pads to a ground plane disposed external to the IC to reduce pin count for the IC. - View Dependent Claims (11, 12, 13, 14, 15, 16)
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17. A low pin count integrated circuit (IC) comprises:
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a wireless power receive circuit coupled to receive a transmission of an electromagnetic signal and convert the electromagnetic signal to a DC voltage; a power management unit (PMU) to manage distribution of the DC voltage to a plurality of circuit modules; a die that supports the circuit module and the PMU, wherein the die includes return pads for coupling to a power return of the PMU and a power return of the circuit; and a package substrate that supports the die and includes return pins for coupling the return pads to a ground plane disposed external to the IC to reduce pin count for the IC, and wherein at least one of the die and the package substrate support the wireless power receive circuit, in which wireless delivery of power is to be achieved without use of a supply voltage pin to reduce pin count for the IC. - View Dependent Claims (18, 19, 20)
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Specification