Halogen-free flame retardant resin composition, and, prepreg, laminate, and laminate for printed circuit made therefrom

• US 8,445,605 B2
• Filed: 08/23/2010
• Issued: 05/21/2013
• Est. Priority Date: 08/24/2009
• Status: Active Grant

• Current Assignee: Guangdong Shengyi SCI Tech Company Limited
• Original Assignee: Guangdong Shengyi SCI Tech Company Limited
• Inventors: Li, Jie, He, Yueshan, Cheng, Tao, Su, Shiguo, Wang, Biwu
• Primary Examiner(s): SELLERS, ROBERT E
• Application Number:
  US12/861,742
• Publication Number:
  US 20110045303A1
• Time in Patent Office: 1,002 Days
• Field of Search: None
• US Class Current: 525/481
• CPC Class Codes: C08G 59/5073 having two nitrogen atoms in the ring
• CPC Class Codes: C08G 59/621 Phenols
• CPC Class Codes: C08G 59/686 containing nitrogen
• CPC Class Codes: C08J 2385/02 containing phosphorus
• CPC Class Codes: C08J 2463/00 Characterised by the use of epoxy resins; Derivatives of epoxy resins
• CPC Class Codes: C08J 5/249 characterised by the additives used in the prepolymer mixture
• CPC Class Codes: C08K 5/357 Six-membered rings
• CPC Class Codes: C08K 5/5399 Phosphorus bound to nitrogen
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: H05K 1/0326 containing O
• CPC Class Codes: H05K 1/0353 consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
• CPC Class Codes: H05K 1/0366 reinforced, e.g. by fibres, fabrics H05K1/036 takes precedence
• CPC Class Codes: H05K 2201/012 Flame-retardant; Preventing of inflammation
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: Y10T 428/24994 Fiber embedded in or on the surface of a polymeric matrix
• CPC Class Codes: Y10T 428/31511 Of epoxy ether
• CPC Class Codes: Y10T 428/31529 Next to metal

Abstract

The present invention provides a halogen-free flame retardant resin composition, and, a prepreg, a laminate, and a laminate for printed circuit that are made from the halogen-free flame retardant resin composition. The halogen-free flame retardant resin composition comprises: (A) 40-80 parts by weight of the mixture of a phenoxyphosphazene compound (A1) and a dihydrobenzoxazine ring-containing compound (A2), and, the weight ratio between the phenoxyphosphazene compound (A1) and the dihydrobenzoxazine ring-containing compound (A2) being between 1:10 and 1:2; (B) 15-45 parts by weight of a polyepoxy compound; (C) 5-25 parts by weight of a phenolic resin type hardener; and (D) 0.1-1 parts by weight of an imidazole type compound as the curing accelerator. The prepreg, the laminate, and the laminate for printed circuit that are made from the halogen-free flame retardant resin composition provided by the present invention, have excellent flame retardancy, as well as has high glass transition temperature (Tg), high thermal resistance, high flexural strength, high reliability, low dielectric dissipation factor, low moisture, low C.T.E, good chemical resistance, and good processability.

Claims

1. A halogen-free flame retardant resin composition, calculating according to the parts by weight of organic solids, comprising:

(A) 40-80 parts by weight of the mixture of a phenoxyphosphazene compound (A1) and a dihydrobenzoxazine ring-containing compound (A2), and, the weight ratio between the phenoxyphosphazene compound (A1) and the dihydrobenzoxazine ring-containing compound (A2) being between 1;

10 and 1;

2;

(B) 15-45 parts by weight of a polyepoxy compound;

(C) 5-25 parts by weight of a phenolic resin hardener;

(D) 0.1-1 parts by weight of an imidazole compound as the curing accelerator,

wherein the softening point of the phenoxyphosphazene compound is between 60°

C. and 150°

C.;

the phenoxyphosphazene compound (A1) is a mixture of the cyclophenoxyphosphazene compounds shown with the structural formula (α

) and the linear phenoxyphosphazene compounds shown with the structural formula (β

), and the components comprise the following;

hexaphenoxycyclotriphosphazene compound (m=3), of which the weight ratio is between 70% and 90%;

octaphenoxycyclotetraphosphazene compound (m=4), of which the weight ratio is between 3% and 20%; and

other cyclophenoxyphosphazene compounds (m≧

5), and the linear phenoxyphosphazene compounds, of which the weight ratio are between 1% and 10%;

2. The halogen-free flame retardant resin composition of claim 1, wherein the dihydrobenzoxazine ring-containing compound (A2) comprises at least one of the bisphenol-A benzoxazine resin, bisphenol-F benzoxazine resin, phenolphthalein benzoxazine resin, and MDA (4,4′

-Methylenedianiline) benzoxazine resin shown with the structural formula (γ

) or (δ

) relatively;

3. The halogen-free flame retardant resin composition of claim 1, wherein the polyepoxy compound (B) is at least one compound selected from bisphenol-A epoxy resin, bisphenol-F epoxy resin, phenol novolac epoxy resin, o-cresol novolac epoxy resin, bisphenol-A novolac epoxy resin, oxazolidone ring-containing halogen-free epoxy resin, and epoxide polybutadiene.

4. The halogen-free flame retardant resin composition of claim 1, wherein the phenolic resin type hardener is at least one compound selected from phenol novolac resin, bisphenol-A novolac resin, nitrogen-containing novolac resin, and phosphorus-containing novolac resin.

5. The halogen-free flame retardant resin composition of claim 1, wherein the imidazole compound (D) as the curing accelerator is at least one compound selected from 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, and 2-undecylimidazole.

6. The halogen-free flame retardant resin composition of claim 1, further comprising 6-300 parts by weight of an inorganic filler;

the inorganic filler is a mixture of aluminium hydroxide and silica and other inorganic fillers.

7. The halogen-free flame retardant resin composition of claim 1, further defined as a prepreg made from the halogen-free flame retardant resin composition comprising a base material and the halogen-free flame retardant resin composition, the halogen-free flame retardant resin composition adhering to the base material after the base material being impregnated in the resin composition and then being dried.

8. The halogen-free flame retardant resin composition of claim 1, further defined as a laminate made from the halogen-free flame retardant resin composition comprising a plurality of prepregs mutually overlapped;

each prepreg including a base material and a halogen-free flame retardant resin composition, the halogen-free flame retardant resin composition adhering to the base material after the base material being impregnated in the resin composition and then being dried.

9. The halogen-free flame retardant resin composition of claim 1, further defined as a laminate for printed circuit made from the halogen-free flame retardant resin composition comprising a plurality of prepregs mutually overlapped and a metal foil arranged to one or two surfaces of the overlapped prepregs;

each prepreg including a base material and a halogen-free flame retardant resin composition, the halogen-free flame retardant resin composition adhering to the base material after the base material being impregnated in the resin composition and then being dried.