Device comprising a field-effect transistor in a silicon-on-insulator
First Claim
1. A semiconductor device, comprisinga semiconductor-on-insulator (SeOI) structure, comprising:
- a substrate;
an insulating layer on the substrate; and
a semiconductor layer on the insulating layer, wherein a first field-effect-transistor (FET) is formed therein, and further wherein the first FET comprises;
a channel region in the substrate;
a dielectric layer formed at least partially from a part of the insulating layer of the semiconductor-on-insulator structure; and
a gate formed at least partially from a first part of the semiconductor layer of the semiconductor-on-insulator structure; and
a second FET formed in the semiconductor-on-insulator structure, the structure comprising a channel region and source and drain regions made of a second part of the semiconductor layer of the semiconductor-on-insulator structure;
wherein the first part of the semiconductor layer of the SeOI structure and the second part of the semiconductor layer of the SeOI structure at least partially overlap each other.
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Abstract
The present invention relates to a semiconductor device that has a semiconductor-on-insulator (SeOI) structure, which includes a substrate, an insulating layer such as an oxide layer on the substrate and a semiconductor layer on the insulating layer with a field-effect-transistor (FET) formed in the SeOI structure from the substrate and deposited layers, wherein the FET has a channel region in the substrate, a gate dielectric layer that is made from at least a part of the oxide layer of the SeOI structure; and a gate electrode that is formed at least partially from a part of the semiconductor layer of the SeOI structure. The invention further relates to a method of forming one or more field-effect-transistors or metal-oxide-semiconductor transistors from a semiconductor-on-insulator structure that involves patterning and etching the SeOI structure, forming shallow trench isolations, depositing insulating, metal or semiconductor layers, and removing mask and/or pattern layers.
88 Citations
20 Claims
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1. A semiconductor device, comprising
a semiconductor-on-insulator (SeOI) structure, comprising: -
a substrate; an insulating layer on the substrate; and a semiconductor layer on the insulating layer, wherein a first field-effect-transistor (FET) is formed therein, and further wherein the first FET comprises; a channel region in the substrate; a dielectric layer formed at least partially from a part of the insulating layer of the semiconductor-on-insulator structure; and a gate formed at least partially from a first part of the semiconductor layer of the semiconductor-on-insulator structure; and a second FET formed in the semiconductor-on-insulator structure, the structure comprising a channel region and source and drain regions made of a second part of the semiconductor layer of the semiconductor-on-insulator structure; wherein the first part of the semiconductor layer of the SeOI structure and the second part of the semiconductor layer of the SeOI structure at least partially overlap each other. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A semiconductor device comprising:
a semiconductor-on-insulator (SeOI) structure comprising; a substrate; an insulating layer on the substrate; and a semiconductor layer on the insulating layer, wherein a field-effect-transistor (FET) is formed therein as a floating gate FET, and further wherein the FET comprises; a channel region in the substrate; a dielectric layer formed at least partially from a part of the insulating layer of the semiconductor-on-insulator structure; a gate formed at least partially from a first part of the semiconductor layer of the semiconductor-on-insulator structure; a tunnel dielectric formed at least partially from the insulating layer; a floating gate above the tunnel dielectric and formed at least partially from the semiconductor layer; a gate dielectric layer above the floating gate; and a gate electrode formed above the gate dielectric, wherein the floating gate is separated from the gate electrode by the gate dielectric and from the channel region in the substrate by the tunnel dielectric. - View Dependent Claims (19, 20)
Specification