Optical reader having improved back-illuminated image sensor

• US 8,464,952 B2
• Filed: 11/18/2009
• Issued: 06/18/2013
• Est. Priority Date: 11/18/2009
• Status: Active Grant

• Current Assignee: Hand Held Products Incorporated (Honeywell International Inc.)
• Original Assignee: Hand Held Products Incorporated (Honeywell International Inc.)
• Inventors: Chernyakov, Alexey, Van Volkinburg, Daniel, Jovanovski, Brian
• Primary Examiner(s): LEE, SEUNG H
• Application Number:
  US12/621,088
• Publication Number:
  US 20110114728A1
• Time in Patent Office: 1,308 Days
• Field of Search: 23547201-47203, 235/454, 235/462.11
• US Class Current: 235/454
• CPC Class Codes: G06K 7/10564 Light sources
• CPC Class Codes: G06K 7/10732 Light sources
• CPC Class Codes: G06K 7/10831 Arrangement of optical elements, e.g. lenses, mirrors, prisms optical elements per se G02B

Abstract

An optical reading device for collecting and processing symbology data comprising: a back-illuminated image sensor for converting light reflected from an information bearing indicia (IBI) into output signals representative thereof; receive optics for directing light from the target to the back-illuminated image sensor; a processor for decoding the output signals; an illumination source for generating illumination light illuminating the target and illumination optics for directing the illumination light onto the target and a housing encompassing the back-illuminated image sensor, receive optics and illumination source adapted for hand held operation.

Claims

1. An optical reading device for collecting and processing symbology data comprising:

a back-illuminated image sensor for converting light reflected from an information bearing indicia (IBI) into output signals representative thereof;

receive optics for directing light from a target to the back-illuminated image sensor;

a processor for decoding the output signals;

an illumination source for generating illumination light illuminating the target and illumination optics for directing the illumination light onto the target;

a housing encompassing the back-illuminated image sensor, receive optics and illumination source adapted for hand held operation

wherein an incident light beam is irradiated to a back face of a chip opposite to another face or surface of the chip on which electrodes are disposed and the back-illuminated image sensor comprises a light converting portion for each pixel on the back face side of the chip, and is provided with portions for processing signal charges.

2. An optical reading device in accordance with claim 1, wherein the back-illuminated image sensor is at least one of the following:

color;

monochrome;

monocolor;

2D;

CCD;

CMOS;

NMOS;

PMOS;

CID and CMD.

3. An optical reading device in accordance with claim 1, wherein a focal point of the receive optics is at infinity.

4. An optical reading device in accordance with claim 1, wherein the IBI is a printed or displayed symbology.

5. An optical reading device in accordance with claim 1, wherein the back-illuminated image sensor is operated in the at least one of the following modes:

rolling shutter;

global shutter and full frame operating mode.

6. An optical reading device in accordance with claim 1, further comprising an aiming generator light source for creating an aiming light pattern on the IBI.

7. An optical reading device in accordance with claim 1, wherein the back-illuminated image sensor has a first circuit layer or tier of a silicon or compound semiconductor device and a second and subsequent tiers having silicon-on-insulator (SOI) based electronics, wherein the back-illuminated image sensor is adapted to be operated with light directly incident on a photo detector without obscuration from pixel circuitry, and wherein a lens is adapted to be associated with each light converting portion to facilitate light being directed appropriately through the light converting portion.

8. An optical reading device in accordance with claim 1, wherein the back-illuminated image sensor comprises a single-wafer-based fabricated in silicon-on-insulator wafers by locating photosensitive elements in a handle wafer.