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Patterning of thin film layers

  • US 8,475,872 B2
  • Filed: 11/25/2009
  • Issued: 07/02/2013
  • Est. Priority Date: 08/19/2009
  • Status: Active Grant
First Claim
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1. A method comprising:

  • depositing a first conductive layer onto a surface;

    patterning a dielectric layer on the first conductive layer;

    patterning the first conductive layer using the patterned dielectric layer as a first mask;

    depositing a second conductive layer onto the patterned dielectric layer;

    patterning a passivation layer on the second conductive layer; and

    patterning the second conductive layer using the patterned passivation layer as a second mask.

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