LED lighting system

• US 8,476,829 B2
• Filed: 09/10/2012
• Issued: 07/02/2013
• Est. Priority Date: 01/24/2011
• Status: Expired due to Fees

• Current Assignee: BioLogical Illumination, LLC
• Original Assignee: BioLogical Illumination, LLC
• Inventors: Maxik, Fredric S., Bartine, David E., Soler, Robert R., Bastien, Valerie Ann, Schellack, James Lynn, Grove, Eliza Katar
• Primary Examiner(s): A, Minh D
• Application Number:
  US13/608,935
• Publication Number:
  US 20130005058A1
• Time in Patent Office: 295 Days
• Field of Search: 315/32, 315/35, 315/50, 315/112, 315/114, 315/115, 315/185.R, 315/294, 315/291, 362/84, 362/294, 362/311.02, 362/311.03, 362/311.11, 362/311.15
• US Class Current: 315/35
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21K 9/64 using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
• CPC Class Codes: F21K 9/65 specially adapted for changing the characteristics or the distribution of the light, e.g. by adjustment of parts
• CPC Class Codes: F21K 9/90 Methods of manufacture
• CPC Class Codes: F21V 23/02 the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
• CPC Class Codes: F21V 29/61 characterised by control arrangements
• CPC Class Codes: F21V 31/04 Provision of filling media
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/645 the elements being electrically controlled, e.g. Peltier elements
• CPC Class Codes: H05K 5/065 sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding

Abstract

LED lighting systems and methods of manufacture, which include one or more of the following: (1) a solid state active heat sink for cooling one or more LED chips; (2) a front end power supply providing high voltage to the active heat sink component; (3) a front end power supply that provides a relatively low voltage load to a plurality of LED chips; (4) a front end hybrid power supply with both a high and low voltage output, wherein the high voltage is at least 2kV higher than the low voltage output; (5) an over-mold encapsulating the front end components, wherein the over-mold is provided by a reaction injection molding process; (6) a digital micro-minor device (DMD) for providing pixilated light, color mixing, and intensity control; and (7) an optic having quantum dots (QDs), wherein the light output of the DMD activates for the QDs.

Claims

1. A method of manufacturing an LED lighting system, comprising:

mounting a front end power supply on a substrate;

extending electrical leads from the power supply;

over-molding the front end power supply with a reactive injection molding process; and

electrically coupling an extended electrical lead to one or more light-emitting diodes and to a solid state active heat sink, and further comprising;

mounting a digital micro-mirror device controller to the substrate;

extending a controller lead from the substrate; and

after the over-molding step, electrically coupling the controller lead to a digital micro-mirror device.

2. The method of claim 1, further comprising:

electrically coupling an extended electrical lead to a solid state active heat sink,

and wherein the over-molding material is substantially free of silicon-emitting particles.

3. The method of claim 2, further comprising:

configuring the power supply to deliver at least two outputs.

4. The method of claim 1, further comprising:

configuring the power supply to deliver a high voltage power to the active heat sink.

5. The method of claim 1, further comprising:

configuring the power supply to deliver a low voltage power to the light-emitting diodes.

6. The method of claim 1, further comprising:

configuring the power supply to provide a high voltage power and a low voltage power, wherein the high voltage power is 2 kV or more higher than the low voltage power.

7. The method of claim 1, further comprising:

mounting an optic over the digital micro-mirror device.

8. The method of claim 7, wherein the optic includes a plurality of quantum dots for producing polychromatic light.

9. The method of claim 1, further comprising:

adding one or more additives to the over-molding process, wherein the additives are selected from the group consisting of;

silicon carbide embedded beads, silicon carbide coated on a plastic/metal mesh, boron nitride, silicon nitride, aluminum oxide, low grade industrial diamonds, long carbon fibers, and any combination thereof.

10. The method of claim 9, wherein the silicon carbide embedded beads have a particle size between about 60-80 microns.

11. The method of claim 1, further comprising:

providing a coating on the over-mold to isolate the over-mold from the active heat sink.