Integrated antenna and chip package and method of manufacturing thereof
First Claim
1. An integrated antenna and chip package comprising:
- a first substrate having a first surface and a second surface, the second surface configured to interface the chip package to a circuit board being made of a first dielectric material;
a second substrate disposed on the first surface of the first substrate, the second substrate being made of a second dielectric material;
a communication device disposed on the second substrate;
an antenna disposed on the second substrate and coupled to the communication device, the antenna further comprising;
a common differential feed point having a positive terminal and a negative terminal coupled to corresponding terminals of the communication device;
a differential feed line pair comprising a first feed line having a distal end coupled to the positive terminal and a second feed line having a distal end coupled to the negative terminal, wherein the first and second feed lines are adjacent to one another at the distal end;
a first patch antenna connected to a proximal end of the first feed line; and
a second patch antenna connected to a proximal end of the second feed line, the first patch antenna and the second patch antenna are spaced a full guide wavelength apart, wherein the first and second patch antennas are configured to maximize energy transfer efficiency therebetween to operate as a single full-wave structure at millimeter wave frequencies; and
a lid coupled to the first substrate and configured to encapsulate the antenna and the communication device, the lid having a lens configured to allow radiation from the antenna to be emitted therethrough.
1 Assignment
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Accused Products
Abstract
An integrated antenna and chip package and method of manufacturing thereof. The package includes a first substrate having a first surface and a second surface, The second surface is configured to interface the chip package to a circuit board. A second substrate of the package is disposed on the first surface of the first substrate and is made of a dielectric material. One or more antennas are disposed on the second substrate and a communication device is coupled to the antenna, wherein the communication device is disposed on the second substrate in substantially the same plane as the antenna. A lid is coupled to the first substrate and is configured to encapsulate the antenna and the communication device. The lid has a lens that is configured to allow radiation from the antenna to be emitted therethrough and a shoulder configured to transfer heat produced from the communication device.
50 Citations
15 Claims
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1. An integrated antenna and chip package comprising:
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a first substrate having a first surface and a second surface, the second surface configured to interface the chip package to a circuit board being made of a first dielectric material; a second substrate disposed on the first surface of the first substrate, the second substrate being made of a second dielectric material; a communication device disposed on the second substrate; an antenna disposed on the second substrate and coupled to the communication device, the antenna further comprising; a common differential feed point having a positive terminal and a negative terminal coupled to corresponding terminals of the communication device; a differential feed line pair comprising a first feed line having a distal end coupled to the positive terminal and a second feed line having a distal end coupled to the negative terminal, wherein the first and second feed lines are adjacent to one another at the distal end; a first patch antenna connected to a proximal end of the first feed line; and a second patch antenna connected to a proximal end of the second feed line, the first patch antenna and the second patch antenna are spaced a full guide wavelength apart, wherein the first and second patch antennas are configured to maximize energy transfer efficiency therebetween to operate as a single full-wave structure at millimeter wave frequencies; and a lid coupled to the first substrate and configured to encapsulate the antenna and the communication device, the lid having a lens configured to allow radiation from the antenna to be emitted therethrough. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method for manufacturing an antenna package, the method comprising:
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selecting a first substrate having a first surface and a second surface; coupling a second substrate onto the first surface of the first substrate, the second substrate being made of a dielectric material, wherein the second substrate is in electrical communication with the first substrate; disposing an antenna on the second substrate; disposing a communication device onto the second substrate, wherein the communication device is electrically coupled to the antenna, the antenna further comprising; a common differential feed point having a positive terminal and a negative terminal coupled to corresponding terminals of the communication device; a differential feed line pair comprising a first feed line having a distal end coupled to the positive terminal and a second feed line having a distal end coupled to the negative terminal, wherein the first and second feed lines are adjacent to one another at the distal end; a first patch antenna connected to a proximal end of the first feed line; a second patch antenna connected to a proximal end of the second feed line, the first patch antenna and the second patch antenna are spaced a full guide wavelength apart, wherein the first and second patch antennas are configured to maximize energy transfer efficiency therebetween to operate as a single full-wave structure at millimeter wave frequencies; and attaching a lid to the first substrate to encapsulate the antenna and the communication device therein, the lid having a cavity configured to allow radiation from the antenna to be emitted through the lid. - View Dependent Claims (10, 11, 12, 13, 14)
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15. An integrated antenna and chip package comprising:
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a first substrate having a first surface and a second surface, the second surface configured to interface the integrated antenna and chip package to a circuit board being made of a first dielectric material; a second substrate disposed on the first surface of the first substrate, the second substrate being made of a second dielectric material; a communication device disposed on the second substrate; an antenna disposed on the second substrate, the antenna further comprising; a common differential feed point having a positive terminal and a negative terminal coupled to corresponding terminals of the communication device; a differential feed line pair comprising a first feed line having a distal end coupled to the positive terminal and a second feed line having a distal end coupled to the negative terminal, wherein the first and second feed lines are adjacent to one another at the distal end; a first patch antenna connected to a proximal end of the first feed line; a second patch antenna connected to a proximal end of the second feed line, the first patch antenna and the second patch antenna are spaced a full guide wavelength apart, wherein the first and second patch antennas are configured to maximize energy transfer efficiency therebetween to operate as a single full-wave structure at millimeter wave frequencies.
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Specification