Network node with integrated power distribution

• US 8,477,501 B2
• Filed: 09/09/2011
• Issued: 07/02/2013
• Est. Priority Date: 01/28/2005
• Status: Active Grant

• Current Assignee: I/O Controls Corporation
• Original Assignee: I/O Controls Corporation
• Inventors: Ying, Jeffrey
• Primary Examiner(s): Beaulieu, Yonel
• Application Number:
  US13/229,626
• Publication Number:
  US 20110320065A1
• Time in Patent Office: 662 Days
• Field of Search: 370/254, 361/719, 361/752
• US Class Current: 361/719
• CPC Class Codes: G06F 1/26 Power supply means, e.g. regulation thereof for memories G11C
• CPC Class Codes: H02J 13/00002 characterised by monitoring
• CPC Class Codes: H02J 13/00004 characterised by the power network being locally controlled
• CPC Class Codes: H02J 13/00016 using a wired telecommunication network or a data transmission bus
• CPC Class Codes: H02J 13/00017 using optical fiber
• CPC Class Codes: H02J 2310/12 The local stationary network supplying a household or a building
• CPC Class Codes: H02J 2310/40 The network being an on-board power network, i.e. within a vehicle
• CPC Class Codes: H04L 12/10 Current supply arrangements
• CPC Class Codes: H04L 12/403 with centralised control, e.g. polling
• CPC Class Codes: H04L 2012/40267 Bus for use in transportation systems
• CPC Class Codes: Y02A 30/60 Planning or developing urban green infrastructure
• CPC Class Codes: Y02B 70/30 Systems integrating technologies related to power network operation and communication or information technologies for improving the carbon footprint of the management of residential or tertiary loads, i.e. smart grids as climate change mitigation technology in the buildings sector, including also the last stages of power distribution and the control, monitoring or operating management systems at local level
• CPC Class Codes: Y02D 30/50 in wire-line communication networks, e.g. low power modes or reduced link rate
• CPC Class Codes: Y04S 20/20 End-user application control systems
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

A control network comprises a plurality of network nodes arranged in a plurality of tiers, with first-tier nodes and lower tier nodes. A master control bus interconnects the first-tier nodes, which are also connected to a power source. Lower-tier buses interconnect groups of the lower tier nodes. The lower-tier buses include both data lines and a power source line derived from the power source, allowing the lower tier nodes to selectively distribute power to local loads. A first-tier node may be embodied as a hub controller configured to be connected to one or more of said lower-tier buses. The hub controller may comprise a plurality of internal hub nodes (including a hub master node and hub slave nodes) integrated within the same physical unit.

Claims

1. A network node for use in a control network, comprising:

a pair of housing shellplates adapted to form an outer housing shell when attached together with a hollow interior region defined within the outer housing shell, wherein said housing shellplates further define at least one narrow recess where the shellplates meet, with each housing shellplate constituting a top or bottom wall of the recess;

a circuitboard oriented transversely within the hollow interior region of the outer housing shell with respect to the recess; and

a power transistor disposed within a package and mounted on said circuitboard, said package having a distal end furthest away from said circuit board, wherein the distal end of the power transistor package resides within the recess so as to contact at least one of the housing shellplates defining the recess.

2. The network node of claim 1, wherein the housing shellplates are semi-cylindrical, and when attached together the housing shellplates form a cylindrical outer housing shell.

3. The network node of claim 1, wherein the outer housing shell comprises heat-dissipating fins on an outer surface thereof.

4. The network node of claim 3, wherein the housing shellplates are metallic.

5. The network node of claim 4, wherein the power transistor releases heat through contact with at least one of the metallic housing shellplates, whereby the heat is conveyed to said heat-dissipating fins.

6. The network node of claim 1, further comprising a first connector for receiving one or more data lines and a high power supply signal, and a second connector for attaching to control lines controlling one or more local devices in a vehicle.

7. The network node of claim 6, wherein the outer housing shell forms a tube-like shape with two opposite ends, with a first housing sidewall capping one end of the outer housing shell, and a second housing sidewall capping the other end of the outer housing shell.

8. The network node of claim 7, wherein said first connector resides on the first housing sidewall, and wherein said second connector resides on the second sidewall, such that the data lines and high power supply signal enter and the control lines exit from opposite ends of the outer housing shell.

9. The network node of claim 6, wherein said power transistor is configured to selectively couple high power to one of said local devices in the vehicle.

10. The network node of claim 7, wherein said housing shellplates further define a second narrow recess where the shellplates meet and opposite the at least one narrow recess, with each housing shellplate constituting a top or bottom wall of the second recess, the network node further comprising a second power transistor disposed within a second package and mounted on a back side of said circuitboard, said second package having a distal end furthest away from the back side of said circuit board, wherein the distal end of the second power transistor package resides within the second recess so as to contact at least one of the housing shellplates defining the second recess.

11. The network node of claim 1, further comprising at least one processor for managing communications with an upstream network node via electrical signals transmitted over the data lines.

12. The network node of claim 11, wherein said at least one processor further generates commands for controlling the one or more local devices via the control lines.

13. The network node of claim 12, wherein said at least one processor is disposed on said circuitboard.

14. The network node of claim 1, further comprising a plurality of light-emitting diodes (LEDs) disposed on said circuitboard and protruding from apertures formed in the outer housing shell.

15. The network node of claim 14, wherein said LEDs provide visible status indications under control of said at least one processor.

16. A network node for a control network within a vehicle, the network node comprising:

an outer housing;

a circuitboard disposed within the housing;

a first bus connector coupled to one or more data lines from an upstream network node and for receiving a high power input signal derived from a vehicle battery;

a second bus connector coupled via control lines to one or more external local devices associated within the vehicle under control of the network node; and

at least one processor disposed on said circuitboard for communicating with the upstream network node by transmitting and receiving signals over the data lines coupled to the first bus connector, and for controlling the external local devices through commands transmitted over the control lines.

17. The network node of claim 16, wherein said data lines and high power input signal are transported on a common cable that couples to said first bus connector.

18. The network node of claim 16, wherein said outer housing comprises a pair of housing shellplates which define a hollow interior region when attached together to form at least part of the outer housing.

19. The network node of claim 18, wherein said housing shellplates further define at least one narrow recess where the shellplates meet, with each housing shellplate constituting a top or bottom wall of the recess.

20. The network node of claim 19, wherein the outer housing comprises heat-dissipating fins on an outer surface thereof.

21. The network node of claim 19, wherein the circuitboard is oriented transversely within the hollow interior region of the outer housing with respect to the recess.

22. The network node of claim 21, further comprising a power transistor disposed within a package and mounted on said circuitboard, said package having a distal end furthest away from said circuit board, wherein the distal end of the power transistor package resides within the recess so as to contact at least one of the housing shellplates defining the recess.

23. The network node of claim 22, wherein the housing shellplates are metallic.

24. The network node of claim 22, wherein the power transistor releases heat through contact with at least one of the metallic housing shellplates, whereby the heat is conveyed to said heat-dissipating fins.

25. The network node of claim 18, wherein the housing shellplates are semi-cylindrical, and when attached together the housing shellplates form a cylindrical outer housing shell.

26. The network node of claim 18, wherein the outer housing shell forms a tube-like shape with two opposite ends, with a first housing sidewall capping one end of the outer housing shell, and a second housing sidewall capping the other end of the outer housing shell.

27. The network node of claim 26, wherein said first bus connector resides on the first housing sidewall, and wherein said second bus connector resides on the second sidewall, such that the data lines and high power input signal enter and the control lines exit from opposite ends of the outer housing shell.

28. The network node of claim 16, further comprising a plurality of light-emitting diodes (LEDs) disposed on said circuitboard and protruding from apertures formed in the outer housing.

29. The network node of claim 28, wherein said LEDs provide visible status indications under control of said at least one processor.

30. A method for constructing a network node for use in a control network, comprising:

attaching a pair of housing shellplates to form an outer housing shell with a hollow interior region defined therein, wherein said housing shellplates further define at least one narrow recess where the shellplates meet, with each housing shellplate constituting a top or bottom wall of the recess;

disposing a circuitboard transversely within the hollow interior region of the outer housing shell with respect to the recess; and

mounting a power transistor package on said circuitboard, said power transistor package having a distal end furthest away from said circuit board, such that the distal end of the power transistor package resides within the recess so as to contact at least one of the housing shellplates defining the recess.

31. The method claim 30, wherein the outer housing shell comprises heat-dissipating fins on an outer surface thereof.

32. The method of claim 31, wherein the housing shellplates are metallic.

33. The method of claim 32, wherein during operation the power transistor package releases heat through contact with at least one of the metallic housing shellplates, whereby the heat is conveyed to said heat-dissipating fins.

34. The method of claim 30, further comprising providing a first connector for the network node for receiving one or more data lines and a high power supply signal, and providing a second connector for the network node for attaching to control lines controlling one or more local devices in a vehicle.

35. The method of claim 34, wherein the outer housing shell forms a tube-like shape with two opposite ends, further comprising placing a first housing sidewall to cap one end of the outer housing shell, and placing a second housing sidewall to cap the other end of the outer housing shell.

36. The method of claim 35, wherein said first connector resides on the first housing sidewall, and wherein said second connector resides on the second sidewall, such that the data lines and high power supply signal enter and the control lines exit from opposite ends of the outer housing shell.

37. The method of claim 30, further comprising disposing at least one processor on said circuitboard for managing communications with an upstream network node via electrical signals transmitted over the data lines, and for generating commands to control the one or more local devices via the control lines.

38. The method of claim 30, further comprising disposing a plurality of light-emitting diodes (LEDs) on said circuitboard and protruding from apertures formed in the outer housing shell so as to provide visible status indications.

39. A method for control and power distribution via a network node in a vehicle control network, comprising:

coupling one or more data lines from an upstream source to a first bus connector of the network node;

coupling a high power input signal to the first bus connector;

coupling one or more control lines from a second bus connector of the network node to local devices in a vehicle;

controlling or monitoring the local devices in the vehicle by generating and transmitting commands from the network node to the local devices via the control lines, in response to upstream commands received via the data lines, and receiving electrical signals from the local devices; and

providing high power to at least one of the local devices in the vehicle by selectively coupling the high power input signal to the local device through a high power switch.

40. The method of claim 39, wherein said data lines and high power input signal are transported on a common cable that couples to said first bus connector.

41. The method of claim 39, wherein the network node comprises a pair of housing shellplates forming an outer housing and defining a hollow interior region when attached together.

42. The method of claim 41, wherein said housing shellplates further define at least one narrow recess where the shellplates meet, with each housing shellplate constituting a top or bottom wall of the recess.

43. The method of claim 42, wherein the outer housing comprises heat-dissipating fins on an outer surface thereof.

44. The method of claim 43, wherein a circuitboard is disposed within the hollow interior region of the outer housing, and wherein at least one processor is mounted on said circuitboard.

45. The method of claim 44, wherein the high power switch contained within a package mounted on said circuitboard, said package having a distal end furthest away from said circuit board, wherein the distal end of the package resides within the recess so as to contact at least one of the housing shellplates defining the recess.

46. The method of claim 45, wherein during operation the high power switch releases heat through contact with at least one of the metallic housing shellplates, whereby the heat is conveyed to said heat-dissipating fins.

47. The method of claim 44, wherein the at least one processor controls the high power switch to selectively supply power from the high power input signal to the local device.

48. The method of claim 39, wherein said first bus connector resides on a first housing sidewall disposed at a first end of the outer housing, and wherein said second bus connector resides on a second sidewall disposed at a second end of the outer housing opposite said first end, such that the data lines and high power input signal enter and the control lines exit from opposite ends of the outer housing shell.

49. The method of claim 39, wherein said network node includes a plurality of light-emitting diodes (LEDs) for providing visible status indications.

50. The method of claim 39, wherein the high power input signal is derived from a vehicle battery.