Optical integrator for an illumination system of a microlithographic projection exposure apparatus
First Claim
Patent Images
1. A method of manufacturing an array of elongated microlenses configured to be used in an illumination system of a microlithographic projection exposure apparatus, the method comprising:
- a) repeatedly moving a cutting tool comprising a cutting edge relative to a substrate in a fly-cut process so that the cutting edge cuts into the substrate; and
b) moving the substrate during step a) along a longitudinal direction;
c) moving the substrate at least substantially perpendicular to the longitudinal direction; and
d) repeating a) and b) to provide the array of elongated microlenses,wherein the method comprises rotating the cutting tool around a rotational axis, the cutting edge points away from the rotational axis, and the elongated microlenses have longitudinal axes which are parallel to the longitudinal direction.
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Abstract
The disclosure relates to an optical integrator configured to produce a plurality of secondary light sources in an illumination system of a microlithographic projection exposure apparatus. The disclosure also relates to a method of manufacturing an array of elongated microlenses for use in such an illumination system. Arrays of elongated microlenses are often contained in optical integrators or scattering plates of such illumination systems.
24 Citations
48 Claims
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1. A method of manufacturing an array of elongated microlenses configured to be used in an illumination system of a microlithographic projection exposure apparatus, the method comprising:
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a) repeatedly moving a cutting tool comprising a cutting edge relative to a substrate in a fly-cut process so that the cutting edge cuts into the substrate; and b) moving the substrate during step a) along a longitudinal direction; c) moving the substrate at least substantially perpendicular to the longitudinal direction; and d) repeating a) and b) to provide the array of elongated microlenses, wherein the method comprises rotating the cutting tool around a rotational axis, the cutting edge points away from the rotational axis, and the elongated microlenses have longitudinal axes which are parallel to the longitudinal direction. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29)
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30. A method of reworking an array of elongated microlenses having a maximum pitch, the array of elongated microlenses being configured for use in an illumination system of a microlithographic projection exposure apparatus, the method comprising:
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exposing a portion of an elongated microlens to an ion beam having a cross section with a maximum dimension greater than a maximum pitch of the portion of the elongated microlens, wherein an orientation between the portion of the elongated microlens and the ion beam is changed to adjust for a modification of a surface profile of the elongated microlens by the ion beam.
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31. A method of manufacturing an array of elongated microlenses configured to be used in an illumination system of a microlithographic projection exposure apparatus, the method comprising:
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a) repeatedly moving a cutting tool comprising a cutting edge relative to a substrate in a fly-cut process so that the cutting edge cuts into the substrate; and b) moving the substrate during step a) along a longitudinal direction; c) moving the substrate at least substantially perpendicular to the longitudinal direction; and d) repeating a) and b) to provide the array of elongated microlenses, wherein the method comprises rotating the cutting tool with a rotational frequency in excess of 5000 1/min, and the elongated microlenses have longitudinal axes which are parallel to the longitudinal direction. - View Dependent Claims (32)
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33. A method of manufacturing an array of elongated microlenses configured to be used in an illumination system of a microlithographic projection exposure apparatus, the method comprising:
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a) repeatedly moving a cutting tool comprising a cutting edge relative to a substrate in a fly-cut process so that the cutting edge cuts into the substrate; and b) moving the substrate during step a) along a longitudinal direction; c) moving the substrate at least substantially perpendicular to the longitudinal direction; and d) repeating a) and b) to provide the array of elongated microlenses, wherein the method comprises reworking a portion of the surface of an elongated microlens to change a surface profile of the elongated microlens, and the elongated microlenses have longitudinal axes which are parallel to the longitudinal direction. - View Dependent Claims (34, 35)
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36. A method of manufacturing an array of elongated microlenses configured to be used in an illumination system of a microlithographic projection exposure apparatus, the method comprising:
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a) repeatedly moving a cutting tool comprising a cutting edge relative to a substrate in a fly-cut process so that the cutting edge cuts into the substrate; and b) moving the substrate during step a) along a longitudinal direction; c) moving the substrate at least substantially perpendicular to the longitudinal direction; and d) repeating a) and b) to provide the array of elongated microlenses, wherein the method comprises exposing a portion of an elongated microlens to an ion beam, and the elongated microlenses have longitudinal axes which are parallel to the longitudinal direction. - View Dependent Claims (37, 38, 39, 40, 41, 42, 43, 44)
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45. A method of manufacturing an array of elongated microlenses configured to be used in an illumination system of a microlithographic projection exposure apparatus, the method comprising:
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a) repeatedly moving a cutting tool comprising a cutting edge relative to a substrate in a fly-cut process so that the cutting edge cuts into the substrate; and b) moving the substrate during step a) along a longitudinal direction; c) moving the substrate at least substantially perpendicular to the longitudinal direction; and d) repeating a) and b) to provide the array of elongated microlenses, wherein; the substrate is a CaF2 crystal having a surface that is machined by the cutting tool, the surface of the CaF2 crystal being at least substantially parallel to a {111} crystal plane, and the substrate is oriented with respect to the moving cutting tool so that the cutting edge cuts into the substrate along an actual cutting direction which forms a deviation angle of less than 20°
to an ideal cutting direction, the ideal cutting direction being perpendicular to one of the three {100} crystal planes, and the ideal cutting direction pointing toward a corner of a triangle formed by the intersection of the {111 } crystal plane with the three {100} crystal planesthe elongated microlenses have longitudinal axes which are parallel to the longitudinal direction. - View Dependent Claims (46, 47, 48)
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Specification