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Semiconductor device

  • US 8,521,120 B2
  • Filed: 11/14/2011
  • Issued: 08/27/2013
  • Est. Priority Date: 10/17/2006
  • Status: Expired due to Fees
First Claim
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1. A semiconductor device comprising:

  • a first coil over a substrate, the first coil being configured so that an electromagnetic induction is generated between the first coil and a first device;

    a first power supply circuit electrically connected to the first coil;

    a second coil over the substrate, the second coil being configured so that an electromagnetic induction is generated between the second coil and a second device; and

    a second power supply circuit electrically connected to the second;

    coil,wherein the second coil is lateral to the first coil, andwherein the second coil does not overlap with the first coil.

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