Method and apparatus for using flex circuit technology to create an electrode

• US 8,546,701 B2
• Filed: 10/19/2011
• Issued: 10/01/2013
• Est. Priority Date: 02/27/2006
• Status: Active Grant

• Current Assignee: Edwards Lifesciences Corporation
• Original Assignee: Edwards Lifesciences Corporation
• Inventors: Curry, Kenneth M.
• Primary Examiner(s): NORRIS, JEREMY C
• Application Number:
  US13/276,646
• Publication Number:
  US 20120037406A1
• Time in Patent Office: 713 Days
• Field of Search: 174/250, 174/255, 174/261
• US Class Current: 174/261
• CPC Class Codes: A61B 2562/125 characterised by the manufacture of electrodes
• CPC Class Codes: A61B 5/1486 using enzyme electrodes, e.g. with immobilised oxidase
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: G01N 27/3271 Amperometric enzyme electrodes for analytes in body fluids, e.g. glucose in blood amperometry per se G01N27/49; aspects concerning the enzyme reagent C12Q1/001
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/118 specially for flexible printed circuits, e.g. using folded portions
• CPC Class Codes: H05K 2201/035 Paste overlayer, i.e. conductive paste or solder paste over conductive layer
• CPC Class Codes: H05K 2201/09436 Pads or lands on permanent coating which covers the other conductors
• CPC Class Codes: H05K 2203/0574 Stacked resist layers used for different processes
• CPC Class Codes: H05K 3/247 Finish coating of conductors by using conductive pastes, inks or powders
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673
• CPC Class Codes: H05K 3/4664 Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders H05K3/4647 takes precedence
• CPC Class Codes: Y10T 29/4916 Simultaneous circuit manufacturing

Abstract

A method of creating an active electrode that may include providing a flex circuit having an electrode made of a first material and providing a first mask over the flex circuit, the first mask having an offset region and an opening that exposes the electrode. The method may also include depositing a second material over the offset region and the opening, the second material being different from the first material and providing a second mask over the second material, the second mask having an opening over a portion of the second material that is over the offset region.

Claims

1. An electrode, comprising:

a substrate having a conductive trace made of a first material;

a first mask positioned over the conductive trace, the first mask having a first opening over a portion of the conductive trace;

a material of interest made of a second material and positioned over a portion of the conductive trace and over a portion of the first mask;

a second mask over the material of interest, the second mask having a second opening over a portion of the material of interest, the second opening being offset from the first opening and

a membrane material disposed within the second opening and over the material of interest wherein the membrane contains glucose oxidase enzyme.

2. The electrode of claim 1, wherein the first opening is positioned along a first axis and the second opening is positioned along a second axis that is not coincident with the first axis.

3. The electrode of claim 1, wherein the first opening is positioned along a first plane and the second opening is positioned along a second plane that is not coincident with the first plane.

4. The electrode of claim 1, wherein the conductive trace is made of a copper material and the material of interest is made of a material that is not copper.

5. The electrode of claim 1, wherein the substrate is a flexible dielectric.