RFIC chip mounting structure

• US 8,546,927 B2
• Filed: 09/01/2011
• Issued: 10/01/2013
• Est. Priority Date: 09/03/2010
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Shiroki, Koji, Osamura, Makoto, Kurihara, Takeshi, Mizuyama, Masami
• Primary Examiner(s): Parekh, Nitin
• Application Number:
  US13/223,429
• Publication Number:
  US 20120056337A1
• Time in Patent Office: 761 Days
• Field of Search: 257/728, 257/778, 257/679, 257/773, 257/786, 257/E23.069
• US Class Current: 257/679
• CPC Class Codes: G06K 19/07754 the connection being galvanic
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/07802 not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 1/36 Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewithH01Q1/08, H01Q1/14 take precedence
• CPC Class Codes: H01Q 9/285 Planar dipole H01Q9/065 takes precedence; patch antenna H01Q9/0407

Abstract

An RFIC module includes an RFIC chip that is mounted on a mounting substrate and that is encapsulated with an encapsulation resin layer. The mounting substrate includes a flexible base and electrodes provided on the flexible base. External terminals are disposed near four corners of a mounting surface of the RFIC chip. One of a plurality of mounting lands located on the surface of the flexible base is a shared mounting land and defines an integrated mounting land that is shared by an RF terminal and an NC terminal of the RFIC chip. The shared mounting land is arranged to cover one side of the RFIC chip when viewed from above.

Claims

1. A radio frequency integrated circuit chip mounting structure comprising:

a radio frequency integrated circuit chip including an RF circuit and a plurality of external terminals including a radio frequency terminal that is electrically connected to the RF circuit and an electrically independent terminal that is not electrically connected to the RF circuit; and

a mounting substrate including a flexible base and a plurality of mounting lands which are located on a surface of the flexible base, the plurality of external terminals of the radio frequency integrated circuit chip being electrically connected to the plurality of mounting lands;

at least one of the plurality of mounting lands being a shared mounting land to which the radio frequency terminal and the electrically independent terminal are electrically connected in common; and

the shared mounting land being arranged to cover at least one side of the radio frequency integrated circuit chip when viewed from above.

2. The radio frequency integrated circuit chip mounting structure according to claim 1, wherein the shared mounting land is arranged to cover two adjacent sides of the radio frequency integrated circuit chip when viewed from above.

3. The radio frequency integrated circuit chip mounting structure according to claim 1, wherein the mounting substrate includes a plurality of external connection terminal electrodes located on a lower surface of the mounting substrate and which are electrically connected to the mounting lands, and at least one of the plurality of external connection terminal electrodes is arranged to cover at least one side of the radio frequency integrated circuit chip when viewed from above.

4. The radio frequency integrated circuit chip mounting structure according to claim 1, wherein the plurality of external terminals of the radio frequency integrated circuit chip and the mounting lands of the mounting substrate are joined to each other by melted metal particles or solidified electroconductive paste.