Mesoscale and microscale device fabrication methods using split structures and alignment elements

• US 8,551,314 B2
• Filed: 11/03/2009
• Issued: 10/08/2013
• Est. Priority Date: 05/07/2002
• Status: Expired due to Fees

• Current Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Original Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Inventors: Cohen, Adam L., Lockard, Michael S., Smalley, Dennis R.
• Primary Examiner(s): Hendricks, Keith
• Assistant Examiner(s): Sherrill, Stefanie
• Application Number:
  US12/611,795
• Publication Number:
  US 20100276077A1
• Time in Patent Office: 1,435 Days
• Field of Search: 205/118, 205/223
• US Class Current: 205/118
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B81B 2201/042 Micromirrors, not used as optical switches
• CPC Class Codes: B81C 1/00293 maintaining a controlled atmosphere with processes not provided for in B81C1/00285
• CPC Class Codes: B81C 1/00333 Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
• CPC Class Codes: B81C 2201/0197 Processes for making multi-layered devices not provided for in groups B81C2201/0176 - B81C2201/0192
• CPC Class Codes: B81C 2203/0145 Hermetically sealing an opening in the lid
• CPC Class Codes: C25D 1/003 3D structures, e.g. superposed patterned layers
• CPC Class Codes: C25D 1/10 Moulds; Masks; Masterforms
• CPC Class Codes: C25D 5/022 using masking means
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: H01P 1/202 Coaxial filters cascaded coaxial cavities H01P1/205
• CPC Class Codes: H01P 11/00 Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
• CPC Class Codes: H01P 11/005 Manufacturing coaxial lines
• CPC Class Codes: H01P 3/06 Coaxial lines
• CPC Class Codes: H01P 5/183 at least one of the guides being a coaxial line
• CPC Class Codes: H05K 3/4647 by applying an insulating layer around previously made via studs
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor

Abstract

Various embodiments of the invention are directed to formation of mesoscale or microscale devices using electrochemical fabrication techniques where structures are formed from a plurality of layers as opened structures which can be folded over or other otherwise combined to form structures of desired configuration. Each layer is formed from at least one structural material and at least one sacrificial material. The initial formation of open structures may facilitate release of the sacrificial material, ability to form fewer layers to complete a structure, ability to locate additional materials into the structure, ability to perform additional processing operations on regions exposed while the structure is open, and/or the ability to form completely encapsulated and possibly hollow structures.

Claims

1. A method for forming at least a portion of a three-dimensional structure having a desired configuration, comprising:

a. forming at least a first portion of the structure and a second portion of a structure from a plurality of adhered layers, wherein each of the plurality of adhered layers comprise at least one sacrificial material and at least one structural material, wherein at least one of the at least one structural material or the at least one sacrificial material is selectively deposited, wherein the first portion and the second portion each comprise the at least one structural material, wherein the first portion has a first surface and the second portion has a second surface where the first and second surfaces are separated from one another during formation of the plurality of adhered layers but which are to be located, when the structure has the desired configuration, in a relationship to one another that is selected from the group consisting of;

(1) in contact with one another or (2) in proximity to one another; and

b. relatively rotating the first and second portions toward one another to bring the first and second surfaces into the relationship.

2. The method of claim 1 wherein the method additionally comprises:

c. securing the first portion and the second portion in the relationship.

3. The method of claim 2 wherein the securing comprises bonding with a material selected from the group comprising:

(1) solder, (2) a eutectic material, and (3) gold.

4. The method of claim 2 wherein the securing comprises encapsulating at least a portion of the first portion and at least a portion of the second portion with a dielectric encapsulant.

5. The method of claim 2 wherein the securing comprises engaging at least one locking clip.

6. The method of claim 5 wherein that at least one locking clip comprises at least two locking clips.

7. The method of claim 5 wherein the at least one locking clip is formed, at least in part along with the first portion and the second portion from the plurality of layers.

8. The method of claim 1 wherein the forming results in said first and second portions being attached to one another by a bendable hinge structure.

9. The method of claim 8 wherein the hinge structure comprises a plurality of hinge structures.

10. The method of claim 8 wherein, the hinge structure comprises a configuration having at least one wider region and at least one narrower region wherein bending preferentially occurs in the narrower region.

11. The method of claim 1 wherein the forming results in said first and second portions being joined to one another by at least one pivotable hinge structure.

12. The method of claim 11 wherein the at least one pivotable hinge structure comprises at least two pivotable hinge structures.

13. The method of claim 11 wherein at least one of the first portion or the second portion includes at least one alignment structure which aids in guiding the first and second surfaces into the relationship.

14. The method of claim 11 wherein the at least one alignment structure comprises at least two alignment structures.

15. The method of claim 11 wherein at least one of the first portion or the second portion includes at least one alignment structure that aids in ensuring that the first and second portions are properly located in the relationship.

16. The method of claim 15 wherein the at least one alignment structure comprises at least two alignment structures.

17. The method of claim 1 after forming and prior to relatively rotating, the method additionally comprises separating the structural material forming the first portion and the second portion from the at least one sacrificial material to release the first portion and the second portion.

18. The method of claim 17 wherein the separating removes sacrificial material that would hinder the bringing of the first and second portions into the relationship.

19. The method of claim 17 wherein the separating removes sacrificial material that would be effectively trapped when the first and second portions are brought into the relationship.

20. The method of claim 16 wherein the alignment structure comprises at least one structure which is bent from a formed position to an alignment guiding position.

21. The method of claim 14 wherein the alignment structure comprises at least one structure which is bent from a formed position to an alignment guiding position.