Package for a light emitting element
First Claim
Patent Images
1. A high-brightness LED module comprising:
- a silicon substrate comprising a recess defined by sidewalls and a membrane, wherein at least two micro-vias are disposed in the membrane, the micro-vias comprising conductive material that passes through the membrane; and
a light emitting element mounted to the membrane, wherein a p-contact of the light emitting element is coupled to a first micro-via and an n-contact of the light emitting element is coupled to a second micro-via.
6 Assignments
0 Petitions
Accused Products
Abstract
A high-brightness LED module includes a substrate with a recess in which a light emitting element is mounted. The recess is defined by a sidewalls and a relatively thin membrane. At least two micro-vias are provided in the membrane and include conductive material that passes through the membrane. A p-contact of the light emitting element is coupled to a first micro-via and an n-contact of the light emitting element is coupled to a second micro-via.
457 Citations
20 Claims
-
1. A high-brightness LED module comprising:
- a silicon substrate comprising a recess defined by sidewalls and a membrane, wherein at least two micro-vias are disposed in the membrane, the micro-vias comprising conductive material that passes through the membrane; and
a light emitting element mounted to the membrane, wherein a p-contact of the light emitting element is coupled to a first micro-via and an n-contact of the light emitting element is coupled to a second micro-via. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
- a silicon substrate comprising a recess defined by sidewalls and a membrane, wherein at least two micro-vias are disposed in the membrane, the micro-vias comprising conductive material that passes through the membrane; and
-
17. A light emitting diode module comprising:
-
a substrate having a recess defined by sidewalls of the substrate and a membrane portion of the substrate, wherein the membrane portion has a first surface that defines the recess and a second surface opposite the first surface; a light emitting element mounted within the recess to the first surface of the membrane portion, wherein the light emitting element has an n-contact and a p-contact; a plurality of conductive vias disposed in and extending through the membrane portion from the first surface to the second surface, wherein a portion of the plurality of conductive vias is coupled to the p-contact of the light emitting element and another portion of the plurality of conductive vias is coupled to the n-contact of the light emitting element; and a first under-bump metallization feature and a second under-bump metallization feature disposed at the second surface of the membrane portion, wherein the first under-bump metallization feature is coupled with the portion of the plurality of conductive vias and the second under-bump metallization feature is coupled with the another portion of the plurality of conductive vias. - View Dependent Claims (18, 19, 20)
-
Specification