MEMS device with enhanced resistance to stiction

• US 8,555,720 B2
• Filed: 02/24/2011
• Issued: 10/15/2013
• Est. Priority Date: 02/24/2011
• Status: Active Grant

• Current Assignee: NXP USA, Inc. (NXP Semiconductors NV)
• Original Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Inventors: Schultz, Peter S.
• Primary Examiner(s): KWOK, HELEN C
• Application Number:
  US13/033,854
• Publication Number:
  US 20120216616A1
• Time in Patent Office: 964 Days
• Field of Search: 735/143.2, 735/143.8, 735/143.6, 735/141.6, 735/041.4, 735/10
• US Class Current: 73/514.32
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 2015/0834 the mass constituting a pendulum having the pivot axis disposed symmetrically between the longitudinal ends, the center of mass being shifted away from the plane of the pendulum which includes the pivot axis
• CPC Class Codes: G01P 2015/0871 using stopper structures for limiting the travel of the seismic mass

Abstract

A MEMS device (20) includes a substrate (24) and a movable element (22) adapted for motion relative to the substrate (24). A secondary structure (46) extends from the movable element (22). The secondary structure (46) includes a secondary mass (54) and a spring (56) interconnected between the movable element (22) and the mass (54). The spring (56) is sufficiently stiff to prevent movement of the mass (54) when the movable element (22) is subjected to force within a sensing range of the device (20). When the device (20) is subjected to mechanical shock (66), the spring (56) deflects so that the mass (54) moves counter to the motion of the movable element (22). Movement of the mass (54) causes the movable element (22) to vibrate to mitigate stiction between the movable element (22) and other structures of the device (20) and/or to prevent breakage of components within the device (22).

Claims

1. A microelectromechanical systems (MEMS) device comprising:

a substrate;

a movable element suspended above said substrate and adapted for motion relative to said substrate about a rotational axis interposed between first and second ends of said movable element, said movable element including a first section between said rotational axis and said first end and a second section between said rotational axis and said second end; and

a secondary structure extending from said second end of said movable element and suspended above said substrate, said secondary structure including a secondary mass and a spring element, said secondary mass having a side edge oriented approximately parallel to said second end of said movable element, said spring element being interconnected between said second end of said movable element and said side edge of said secondary mass, and said spring element enabling movement of said secondary mass counter to said motion of said movable element.

2. A MEMS device as claimed in claim 1 further comprising at least one spring member interconnected between said movable element and said substrate for enabling said motion of said movable element about said rotational axis, each of said at least one spring member exhibiting a first stiffness that is less than a second stiffness of said spring element.

3. A MEMS device as claimed in claim 2 wherein said second stiffness of said spring element is at least an order of magnitude greater than a collective stiffness of each of said at least one spring member.

4. A MEMS device as claimed in claim 1 wherein a stiffness of said spring element substantially prevents said movement of said secondary mass counter to said movable element when said movable element is subjected to a force within a sensing range of said MEMS device.

5. A MEMS device as claimed in claim 1 wherein a stiffness of said spring element enables said movement of said secondary mass counter to said movable element when said movable element is subjected to a force that is greater than a sensing range of said MEMS device.

6. A MEMS device as claimed in claim 1 wherein said spring element comprises a torsion spring.

7. A MEMS device as claimed in claim 1 wherein said spring element comprises a compression spring.

8. A MEMS device as claimed in claim 1 wherein said first section between said rotational axis and said first end is characterized by a section length, and a combined length of said second section and said secondary structure extending from said second end of said second section is greater than said section length.

9. A MEMS device as claimed in claim 1 wherein a length of said side edge of said secondary mass is approximately equivalent to a width of said movable element in a direction parallel to said rotational axis.

10. A MEMS device as claimed in claim 1 wherein said

spring element is interconnected between said second end of said movable element and said side edge of said secondary mass at a location offset from a center of a length of said side edge.

11. A MEMS device as claimed in claim 1 wherein said secondary structure includes a bottom surface, said substrate includes a top surface, and said MEMS device further comprises a bump extending from one of said bottom surface and said top surface and positioned in a gap between said substrate and said secondary structure.

12. A microelectromechanical systems (MEMS) device comprising:

a substrate;

a movable element suspended above said substrate and adapted for motion relative to said substrate about a rotational axis interposed between first and second ends of said movable element, said movable element including a first section between said rotational axis and said first end and a second section between said rotational axis and said second end; and

a secondary structure extending from said second end of said movable element and suspended above said substrate, said secondary structure including a secondary mass and a spring element, said secondary mass having a side edge oriented approximately parallel to said second end of said movable element, said spring element being interconnected between said second end of said movable element and said side edge of said secondary mass, and said spring element exhibits a stiffness, wherein;

said stiffness of said spring element enables movement of said secondary mass counter to said movable element when said movable element is subjected to a force that is greater than a sensing range of said MEMS device; and

said stiffness of said spring element substantially prevents said movement of said secondary mass counter to said movable element when said movable element is subjected to a force within said sensing range of said MEMS device.

13. A MEMS device as claimed in claim 12 wherein

said spring element comprises a torsion spring.

14. A MEMS device as claimed in claim 13 wherein said spring element is interconnected between said second end of said movable element and said side edge of said secondary mass at a location offset from a center of a length of said side edge.

15. A microelectromechanical systems (MEMS) device comprising:

a substrate;

a movable element suspended above said substrate, said movable element being adapted for motion about a rotational axis interposed between first and second ends of said movable element, said movable element including a first section between said rotational axis and said first end and a second section between said rotational axis and said second end; and

a secondary structure extending from said second end of said movable element and suspended above said substrate, said secondary structure including a secondary mass and a spring element, said secondary mass having a side edge oriented approximately parallel to said second end of said movable element, said spring element being interconnected between said second end of said movable element and said side edge of said secondary mass, said spring element enabling movement of said secondary mass counter to said motion of said movable element when said movable element is subjected to a force that is greater than a sensing range of said MEMS device.

16. A MEMS device as claimed in claim 15 wherein said spring element comprises a torsion spring.

17. A MEMS device as claimed in claim 15 wherein said first section between said rotational axis and said first end is characterized by a section length, and a combined length of said second section and said secondary structure extending from said second end of said second section is greater than said section length.

18. A MEMS device as claimed in claim 15 wherein said secondary mass includes a side edge oriented approximately parallel to said second end of said movable element, and said spring element is interconnected between said second end of said movable element and said side edge of said secondary mass at a location offset from a center of a length of said side edge.