Negative resist composition, patterning process, and testing process and preparation process of negative resist composition

  • US 8,557,509 B2
  • Filed: 04/16/2010
  • Issued: 10/15/2013
  • Est. Priority Date: 05/18/2009
  • Status: Active Grant
First Claim
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1. A resist patterning process, the resist patterning process by a lithography, comprising, at least,(a) forming a resist film having a film thickness of X(nm) of 50 to 100 nm on a substrate to be processed, said resist film being formed by using a negative resist composition comprising at least(A) a base resin that is alkaline-soluble and is made alkaline-insoluble by action of an acid, and/or a combination of a base resin that is alkaline-soluble and is made alkaline-insoluble by reaction with a crosslinker by action of an acid, with a crosslinker, wherein the base resin contains a phenolic hydroxyl group, wherein 95% or more by mol of the repeating units constituting the base resin include a monomer structure having an aromatic skeleton, the repeating units constituting the base resin include any combination of the repeating units represented by the following general formulae (1) to (3),

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